Inventor · disambiguated record

Wenshi Wang

Also filed as: WANG WENSHI

15 granted patents·1 pending application·8 citations·filing 2020–2023

85Inventor score

Technology areasH10W E21B H01L

Files withZHUHAI ACCESS SEMICONDUCTOR CO LTD14 INST OF EXPLORATION TECHNIQUES CHINESE ACADEMY OF GEOLOGICAL SCIENCES1 NANTONG ACCESS SEMICONDUCTOR CO LTD1

Top patents by PatentIndex Score

16 records

0192US11114310B1Embedded packaging method capable of realizing heat dissipationZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2020·Granted Sep 7, 2021·4 cites·7 claims
0284US11255149B1Multifunctional directional wireline core drilling deviceINST OF EXPLORATION TECHNIQUES CHINESE ACADEMY OF GEOLOGICAL SCIENCES·Filed 2020·Granted Feb 22, 2022·4 cites·10 claims
0370US12148676B2Embedded chip package and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Granted Nov 19, 2024·0 cites·9 claims
0470US11822121B2Cavity substrate having directional optoelectronic transmission channel and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Granted Nov 21, 2023·0 cites·7 claims
0564US12412843B2Support frame structure and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Granted Sep 9, 2025·0 cites·5 claims
0662US11854920B2Embedded chip package and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2020·Granted Dec 26, 2023·0 cites·9 claims
0761US11579362B2Cavity substrate having directional optoelectronic transmission channel and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2021·Granted Feb 14, 2023·0 cites·13 claims
0858US11569177B2Support frame structure and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2020·Granted Jan 31, 2023·0 cites·7 claims
0957US11984414B2Packaging structure with antenna and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2022·Granted May 14, 2024·0 cites·14 claims
1056US11450619B2Embedded packaging structure having shielding cavity and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2021·Granted Sep 20, 2022·0 cites·16 claims
1152US12418988B2Inductor-integrating embedded support frame and substrate, and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2022·Granted Sep 16, 2025·0 cites·5 claims
1252US12002734B2Circuit prearranged heat dissipation embedded packaging structure and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2021·Granted Jun 4, 2024·0 cites·20 claims
1352US2022392862A1Package structure with wettable side surface and manufacturing method thereof, and vertical package moduleZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2022·Application pending·0 cites
1451US11942465B2Embedded structure, manufacturing method thereof and substrateZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2021·Granted Mar 26, 2024·0 cites·8 claims
1550US12463055B2Package substrate manufacturing methodZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2021·Granted Nov 4, 2025·0 cites·10 claims
1641US12400967B2Embedded packaging structure and manufacturing method thereofNANTONG ACCESS SEMICONDUCTOR CO LTD·Filed 2022·Granted Aug 26, 2025·0 cites·13 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →