Inventor · disambiguated record
Wei Wang
Also filed as: WANG WEI · WANG WEI-LUN
20 granted patents·13 pending applications·125 citations·filing 1995–2024
92Inventor score
Files withNIKO SEMICONDUCTOR CO LTD5ADVANCED SEMICONDUCTOR ENG4HEFEI AICHUANGWEI ELECTRONIC TECH CO LTD4WANG WEI3LUCEMITEK CO LTD2
Top patents by PatentIndex Score
33 records- 0187US12048122B2Power module and power deviceNIKO SEMICONDUCTOR CO LTD·Filed 2022·Granted Jul 23, 2024·1 cites·15 claims
- 0283US10025033B2Optical fiber structure, optical communication apparatus and manufacturing process for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Jul 17, 2018·5 cites·18 claims
- 0380US5766379APassivated copper conductive layers for microelectronic applications and methods of manufacturing sameUNIV NEW YORK STATE RES FOUND·Filed 1995·Granted Jun 16, 1998·58 cites·36 claims
- 0477US12438460B1Power management circuit capable of reducing power consumption of electronic devicesNOVATEK MICROELECTRONICS CORP·Filed 2024·Granted Oct 7, 2025·0 cites·18 claims
- 0575US9213138B2Packaging an arcuate planar lightwave circuitJDS UNIPHASE CORP·Filed 2014·Granted Dec 15, 2015·4 cites·20 claims
- 0675US6057223APassivated copper conductive layers for microelectronic applicationsUNIV NEW YORK STATE RES FOUND·Filed 1998·Granted May 2, 2000·41 cites·20 claims
- 0773US9579784B2Connecting structure-contained connection device of electric tool for connection with angle adjusterMETABOWERKE GMBH·Filed 2014·Granted Feb 28, 2017·9 cites·2 claims
- 0870US8582257B2Ultra-low sensitivity ground fault circuit interrupterLOVE CHRISTOPHER·Filed 2011·Granted Nov 12, 2013·4 cites·9 claims
- 0965US2022046705A1Wireless communication device and wireless communication methodSONY GROUP CORP·Filed 2021·Application pending·0 cites
- 1062US9465162B2Packaging an arcuate planar lightwave circuitLUMENTUM OPERATIONS LLC·Filed 2015·Granted Oct 11, 2016·1 cites·20 claims
- 1162US8258842B2Dead-time detecting circuit for inductive load and modulation circuit using the sameWANG WEI·Filed 2010·Granted Sep 4, 2012·2 cites·19 claims
- 1258US2025379125A1Double-sided power device and method for manufacturing the sameNIKO SEMICONDUCTOR CO LTD·Filed 2024·Application pending·0 cites
- 1357US12400930B2Power module packageNIKO SEMICONDUCTOR CO LTD·Filed 2022·Granted Aug 26, 2025·0 cites·10 claims
- 1457US10591688B2Optical device packageADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Mar 17, 2020·0 cites·17 claims
- 1556US2025380365A1Circuit substrate assembly and power moduleNIKO SEMICONDUCTOR CO LTD·Filed 2024·Application pending·0 cites
- 1655US2023230803A1Semiconductor reaction chamberBEIJING NAURA MICROELECTRONICS EQUIPMENT CO LTD·Filed 2023·Application pending·0 cites
- 1753US2023369186A1Power module packageNIKO SEMICONDUCTOR CO LTD·Filed 2022·Application pending·0 cites
- 1852US10268002B2Optical device packageADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Apr 23, 2019·0 cites·16 claims
- 1951US11843336B2Circuit for shifting fixed ground level to floating ground level in motor drive systemHEFEI AICHUANGWEI ELECTRONIC TECH CO LTD·Filed 2021·Granted Dec 12, 2023·0 cites·7 claims
- 2050US2021195636A1Wireless communication device and wireless communication methodSONY CORP·Filed 2017·Application pending·0 cites
- 2149US2025150037A1Dual-output amplifier circuitANALOG DEVICES INC·Filed 2023·Application pending·0 cites
- 2246US11824476B2Circuit for converting temperature change amount into voltage change in motor drive systemHEFEI AICHUANGWEI ELECTRONIC TECH CO LTD·Filed 2021·Granted Nov 21, 2023·0 cites·3 claims
- 2345US2014159060A1Patterned substrate and electro-optical semiconductor elementLUCEMITEK CO LTD·Filed 2013·Application pending·0 cites
- 2444US2014159100A1Patterned substrate and electro-optical semiconductor elementLUCEMITEK CO LTD·Filed 2013·Application pending·0 cites
- 2543US11934216B2Constant current generation circuit for optocoupler isolation amplifier and current precision adjustment methodHEFEI AICHUANGWEI ELECTRONIC TECH CO LTD·Filed 2021·Granted Mar 19, 2024·0 cites·12 claims
- 2643US11363633B2Device and method in radio communication system, and radio communication systemSONY CORP·Filed 2017·Granted Jun 14, 2022·0 cites·18 claims
- 2742US11677339B2Start-up initialization circuit of motor drive systemHEFEI AICHUANGWEI ELECTRONIC TECH CO LTD·Filed 2021·Granted Jun 13, 2023·0 cites·5 claims
- 2841US8207785B2Charge pump circuit with improved reliabilityWANG WEI·Filed 2010·Granted Jun 26, 2012·0 cites·11 claims
- 2939US2015174752A1Connecting structure-contained connection device of electric tool for connection with angle adjusterMETABOWERKE GMBH·Filed 2014·Application pending·0 cites
- 3038US2012212147A1Flyback Energy ConverterKUO CHUN-CHIEN·Filed 2012·Application pending·0 cites
- 3137US8154319B2Three-dimensional architecture for integration of CMOS circuits and nano-material in hybrid digital circuitsWANG WEI·Filed 2008·Granted Apr 10, 2012·0 cites·15 claims
- 3233US2018052281A1Substrate, semiconductor device and semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2016·Application pending·0 cites
- 3332US2011086649A1Methodology for Traffic Control Based on Cross-Carriers Short Message (SMS) ApplicationLINKAGE TECHNOLOGY GROUP CO LTD·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →