Inventor · disambiguated record
Wen-Chou Wu
Also filed as: WU WEN-CHOU
23 granted patents·5 pending applications·70 citations·filing 2008–2024
93Inventor score
Top patents by PatentIndex Score
28 records- 0195US8013258B2Shielding deviceMEDIATEK INC·Filed 2008·Granted Sep 6, 2011·40 cites·23 claims
- 0294US12095142B2Semiconductor package having discrete antenna deviceMEDIATEK INC·Filed 2022·Granted Sep 17, 2024·2 cites·13 claims
- 0392US10847869B2Semiconductor package having discrete antenna deviceMEDIATEK INC·Filed 2018·Granted Nov 24, 2020·9 cites·23 claims
- 0490US11373957B2Semiconductor package with layer structures, antenna layer and electronic componentMEDIATEK INC·Filed 2020·Granted Jun 28, 2022·2 cites·12 claims
- 0586US10700410B2Antenna-in-package with better antenna performanceMEDIATEK INC·Filed 2018·Granted Jun 30, 2020·4 cites·18 claims
- 0683US10680727B2Over the air wireless test system for testing microelectronic devices integrated with antennaMEDIATEK INC·Filed 2018·Granted Jun 9, 2020·2 cites·18 claims
- 0780US10784206B2Semiconductor packageMEDIATEK INC·Filed 2018·Granted Sep 22, 2020·2 cites·17 claims
- 0878US11322823B2Antenna-in-package with frequency-selective surface structureMEDIATEK INC·Filed 2018·Granted May 3, 2022·2 cites·20 claims
- 0978US11169250B2Radar module incorporated with a pattern-shaping deviceMEDIATEK INC·Filed 2018·Granted Nov 9, 2021·2 cites·15 claims
- 1078US2025015483A1Semiconductor package having discrete antenna deviceMEDIATEK INC·Filed 2024·Application pending·0 cites
- 1176US10490511B2Microelectronic assembly with electromagnetic shieldingMEDIATEK INC·Filed 2018·Granted Nov 26, 2019·3 cites·21 claims
- 1275US11837552B2Semiconductor package with layer structures, antenna layer and electronic componentMEDIATEK INC·Filed 2022·Granted Dec 5, 2023·0 cites·19 claims
- 1370US11848481B2Antenna-in-package with frequency-selective surface structureMEDIATEK INC·Filed 2022·Granted Dec 19, 2023·0 cites·20 claims
- 1468US11509038B2Semiconductor package having discrete antenna deviceMEDIATEK INC·Filed 2020·Granted Nov 22, 2022·0 cites·20 claims
- 1566US10916854B2Antenna structure with integrated coupling element and semiconductor package using the sameMEDIATEK INC·Filed 2019·Granted Feb 9, 2021·1 cites·18 claims
- 1665US11821975B2Radar module incorporated with a pattern-shaping deviceMEDIATEK INC·Filed 2021·Granted Nov 21, 2023·0 cites·14 claims
- 1764US11721882B2Semiconductor package having discrete antenna deviceMEDIATEK INC·Filed 2020·Granted Aug 8, 2023·0 cites·14 claims
- 1864US9725607B2Waterproof paint formula and a pen device for using the sameWU WEN-CHOU·Filed 2015·Granted Aug 8, 2017·1 cites·9 claims
- 1961US11050135B2Antenna-in-package with better antenna performanceMEDIATEK INC·Filed 2020·Granted Jun 29, 2021·0 cites·16 claims
- 2057US12230622B2Electronic device with stacked printed circuit boardsMEDIATEK INC·Filed 2022·Granted Feb 18, 2025·0 cites·20 claims
- 2154US2023253389A1Semiconductor package assemblyMEDIATEK INC·Filed 2022·Application pending·0 cites
- 2252US2023116326A1Semiconductor package with tsv dieMEDIATEK INC·Filed 2022·Application pending·0 cites
- 2350US10615494B2Coupling reduction method for antennas in packageMEDIATEK INC·Filed 2017·Granted Apr 7, 2020·0 cites·19 claims
- 2449US10910323B2Semiconductor package with reduced noiseMEDIATEK INC·Filed 2019·Granted Feb 2, 2021·0 cites·14 claims
- 2542US10446508B2Semiconductor package integrated with memory dieMEDIATEK INC·Filed 2017·Granted Oct 15, 2019·0 cites·28 claims
- 2642US10068857B2Semiconductor package assemblyMEDIATEK INC·Filed 2017·Granted Sep 4, 2018·0 cites·36 claims
- 2742US2020051927A1Semiconductor device with an em-integrated damperMEDIATEK INC·Filed 2019·Application pending·0 cites
- 2842US2020051925A1Semiconductor device with an em-integrated damperMEDIATEK INC·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →