Inventor · disambiguated record
Wei-Cheng Wu
Also filed as: WU WEI · WU WEI CHENG
401 granted patents·100 pending applications·5,309 citations·filing 2007–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD391PRO IRODA IND INC33TAIWAN SEMICONDUCTOR MFG19WU WEI-CHENG5DUPONT ELECTRONICS INC4
Top patents by PatentIndex Score
501 records- 0199US11508695B2Redistribution layers in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 22, 2022·7 cites·20 claims
- 0299US10062648B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 28, 2018·70 cites·19 claims
- 0399US9997464B2Dummy features in redistribution layers (RDLS) and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 12, 2018·64 cites·20 claims
- 0499US9741690B1Redistribution layers in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 22, 2017·52 cites·20 claims
- 0599US9372206B2Testing of semiconductor chips with microbumpsTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Jun 21, 2016·1.8k cites·20 claims
- 0699US7969193B1Differential sensing and TSV timing control scheme for 3D-ICNAT UNIV TSING HUA·Filed 2010·Granted Jun 28, 2011·256 cites·20 claims
- 0798US11527502B2Contact pad for semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 13, 2022·4 cites·20 claims
- 0898US10663512B2Testing of semiconductor chips with microbumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 26, 2020·8 cites·14 claims
- 0998US10347606B2Devices employing thermal and mechanical enhanced layers and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 9, 2019·19 cites·20 claims
- 1098US10175294B2Testing of semiconductor chips with microbumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 8, 2019·14 cites·20 claims
- 1198US10163802B2Fan-out package having a main die and a dummy die, and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·76 cites·20 claims
- 1298US9425126B2Dummy structure for chip-on-wafer-on-substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 23, 2016·883 cites·20 claims
- 1398US9128123B2Interposer test structures and methodsLIU TZUAN-HORNG·Filed 2011·Granted Sep 8, 2015·31 cites·20 claims
- 1498US9048233B2Package systems having interposersWU WEI-CHENG·Filed 2010·Granted Jun 2, 2015·1.1k cites·19 claims
- 1597US12048163B2Trench gate high voltage transistor for embedded memoryTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 23, 2024·2 cites·20 claims
- 1697US11901320B2Contact pad for semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 13, 2024·2 cites·20 claims
- 1797US10811394B2Devices employing thermal and mechanical enhanced layers and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 20, 2020·10 cites·20 claims
- 1897US10510674B2Fan-out package having a main die and a dummy die, and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·20 cites·20 claims
- 1997US10468410B2Metal gate modulation to improve kink effectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 5, 2019·13 cites·20 claims
- 2097US9929112B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Mar 27, 2018·19 cites·20 claims
- 2197US9812460B1NVM memory HKMG integration technologyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 7, 2017·29 cites·20 claims
- 2297US9618572B2Testing of semiconductor chips with microbumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 11, 2017·9 cites·20 claims
- 2397US9589857B2Interposer test structures and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Mar 7, 2017·8 cites·20 claims
- 2497US9583591B2Si recess method in HKMG replacement gate technologyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 28, 2017·20 cites·20 claims
- 2597US9116203B2Testing of semiconductor chips with microbumpsTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Aug 25, 2015·13 cites·20 claims
- 2697US8797057B2Testing of semiconductor chips with microbumpsWU WEI-CHENG·Filed 2011·Granted Aug 5, 2014·17 cites·20 claims
- 2796US11830875B2Method to embed planar FETS with FINFETSTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 28, 2023·2 cites·20 claims
- 2896US11169207B2Testing of semiconductor chips with microbumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 9, 2021·3 cites·20 claims
- 2996US10962221B2Flame gun with flow control ringPRO IRODA IND INC·Filed 2018·Granted Mar 30, 2021·5 cites·17 claims
- 3096US10475768B2Redistribution layers in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 12, 2019·11 cites·20 claims
- 3196US10325919B1Mask design for embedded memoryTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 18, 2019·12 cites·20 claims
- 3296US10157852B2Multi-stacked package-on-package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 18, 2018·9 cites·20 claims
- 3396US9659953B2HKMG high voltage CMOS for embedded non-volatile memoryTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 23, 2017·18 cites·20 claims
- 3496US9502343B1Dummy metal with zigzagged edgesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 22, 2016·14 cites·20 claims
- 3596US8283781B2Semiconductor device having pad structure with stress buffer layerWU WEI-CHENG·Filed 2010·Granted Oct 9, 2012·33 cites·20 claims
- 3695US11967563B2Fan-out package having a main die and a dummy dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 23, 2024·2 cites·20 claims
- 3795US11810959B2Transistor layout to reduce kink effectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 7, 2023·2 cites·20 claims
- 3895US9984998B2Devices employing thermal and mechanical enhanced layers and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 29, 2018·9 cites·20 claims
- 3995US9972581B1Routing design of dummy metal cap and redistribution lineTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 15, 2018·14 cites·20 claims
- 4095US9842848B2Embedded HKMG non-volatile memoryTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 12, 2017·12 cites·20 claims
- 4195US9812426B1Integrated fan-out package, semiconductor device, and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 7, 2017·19 cites·20 claims
- 4295US9633869B2Packages with interposers and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Apr 25, 2017·15 cites·20 claims
- 4395US2025365950A1Embedded flash memory device with floating gate embedded in a substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4494US12327819B2Devices employing thermal and mechanical enhanced layers and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 10, 2025·1 cites·20 claims
- 4594US12136627B23DIC structure for high voltage device on a SOI substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 5, 2024·2 cites·20 claims
- 4694US11978740B2Semiconductor-on-insulator (SOI) semiconductor structures including a high-k dielectric layer and methods of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 7, 2024·2 cites·20 claims
- 4794US11933493B2Tool with improved ignition efficiencyPRO IRODA IND INC·Filed 2021·Granted Mar 19, 2024·2 cites·13 claims
- 4894US11515229B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 29, 2022·3 cites·20 claims
- 4994US10650882B2Static random access memory with a supplementary driver circuit and method of controlling the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 12, 2020·16 cites·20 claims
- 5094US9865610B2Si recess method in HKMG replacement gate technologyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 9, 2018·9 cites·20 claims
Showing the top 50 of 501 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →