Inventor · disambiguated record
Wen Yang
Also filed as: YANG WEN · YANG WEN-LUH
2 granted patents·2 pending applications·1 citations·filing 2001–2008
30Inventor score
Top patents by PatentIndex Score
4 records- 0143US6838116B2Oxygen-removing pre-process for copper interconnect grown by electrochemical displacement depositionUNIV FENG CHIA·Filed 2003·Granted Jan 4, 2005·1 cites·9 claims
- 0241US2011182787A1Method for producing titanium tetrachloride by using low-grade titanium materialPANGANG GROUP STEEL VANDADIUM & TITANIUM CO LTD·Filed 2008·Application pending·0 cites
- 0326US7141269B2Molding technique for copper interconnecting wires by electrochemical displacement deposition on the pre-shaped metal layerUNIV FENG CHIA·Filed 2003·Granted Nov 28, 2006·0 cites·8 claims
- 0424US2003100170A1Fast diffusion recipe for silicon by NO complexesUNIV FENG CHIA·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →