Inventor · disambiguated record
Weiyuan Yang
Also filed as: YANG WEIYUAN
2 granted patents·4 pending applications·4 citations·filing 2020–2022
40Inventor score
Files withSIPLP MICROELECTRONICS CHONGQING LTD3ZHUHAI ACCESS SEMICONDUCTOR CO LTD2SIPLP MICROELECTRONICS CHONGQING CO LTD1
Top patents by PatentIndex Score
6 records- 0192US11114310B1Embedded packaging method capable of realizing heat dissipationZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2020·Granted Sep 7, 2021·4 cites·7 claims
- 0245US12402414B2Capacitor and inductor embedded structure and manufacturing method therefor, and substrateZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2020·Granted Aug 26, 2025·0 cites·12 claims
- 0336US2024087912A1Semiconductor packaging methodSIPLP MICROELECTRONICS CHONGQING LTD·Filed 2022·Application pending·0 cites
- 0436US2024203922A1Semiconductor packaging method and semiconductor packaging structureSIPLP MICROELECTRONICS CHONGQING LTD·Filed 2022·Application pending·0 cites
- 0536US2024274501A1Mcm package structure and manufacturing method thereforSIPLP MICROELECTRONICS CHONGQING LTD·Filed 2022·Application pending·0 cites
- 0634US2023268299A1Die and manufacturing method therefor, and chip packaging structure and manufacturing method thereforSIPLP MICROELECTRONICS CHONGQING CO LTD·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →