Inventor · disambiguated record
Weijun Yang
Also filed as: YANG WEIJUN
6 granted patents·4 pending applications·2 citations·filing 2006–2021
66Inventor score
Files withDOW GLOBAL TECHNOLOGIES LLC6JIANGSU CHANGJIANG ELECTRONICS2JIANGSU CHANGIANG ELECTRONICS1UNIV JIANGNAN1
Top patents by PatentIndex Score
10 records- 0183US10590290B2Multi-stage polymer as grinding additive and method of producing the sameDOW GLOBAL TECHNOLOGIES LLC·Filed 2015·Granted Mar 17, 2020·2 cites·10 claims
- 0258US2025059380A1Aqueous coating compositionDOW GLOBAL TECHNOLOGIES LLC·Filed 2021·Application pending·0 cites
- 0354US11186743B2Waterborne epoxy coating compositionDOW GLOBAL TECHNOLOGIES LLC·Filed 2017·Granted Nov 30, 2021·0 cites·12 claims
- 0452US12146074B2Dispersant and waterborne epoxy coating compositionDOW GLOBAL TECHNOLOGIES LLC·Filed 2018·Granted Nov 19, 2024·0 cites·13 claims
- 0552US11407917B2Coating compositionDOW GLOBAL TECHNOLOGIES LLC·Filed 2016·Granted Aug 9, 2022·0 cites·7 claims
- 0647US11591465B2Polyester composites and their preparation methodsUNIV JIANGNAN·Filed 2020·Granted Feb 28, 2023·0 cites·17 claims
- 0743US11186726B2Aqueous polymer dispersion and aqueous coating composition comprising the sameDOW GLOBAL TECHNOLOGIES LLC·Filed 2017·Granted Nov 30, 2021·0 cites·9 claims
- 0841US2008258273A1Package Structure With Flat Bumps For Electronic Device and Method of Manufacture the SameJIANGSU CHANGJIANG ELECTRONICS·Filed 2006·Application pending·0 cites
- 0941US2008315412A1Package Structure with Flat Bumps for Integrate Circuit or Discrete Device and Method of Manufacture the SameJIANGSU CHANGJIANG ELECTRONICS·Filed 2006·Application pending·0 cites
- 1040US2008285251A1Packaging Substrate with Flat Bumps for Electronic Devices and Method of Manufacturing the SameJIANGSU CHANGIANG ELECTRONICS·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →