Inventor · disambiguated record
Wen Yin
Also filed as: YIN WEN · YIN WEN-CHENG
15 granted patents·13 pending applications·25 citations·filing 2007–2024
87Inventor score
Files withTAIWAN NAME PLATE CO LTD10QUALCOMM INC6HUAWEI TECH CO LTD3INTEL CORP3WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD2
Top patents by PatentIndex Score
28 records- 0182US11067459B1Stress sensor structure and a manufacturing method thereofNAT CENTER FOR ADVANCED PACKAGING CO LTD·Filed 2017·Granted Jul 20, 2021·6 cites·10 claims
- 0282US8930875B2Estimating power supply of a 3D ICIBM·Filed 2013·Granted Jan 6, 2015·8 cites·9 claims
- 0380US10168357B2Coated probe tips for plunger pins of an integrated circuit package test systemINTEL CORP·Filed 2015·Granted Jan 1, 2019·2 cites·2 claims
- 0474US2025142969A1Display panelWUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD·Filed 2024·Application pending·0 cites
- 0573US7744005B2Induction card with a printed antennaTAIWAN NAME PLATE CO LTD·Filed 2008·Granted Jun 29, 2010·9 cites·9 claims
- 0662US12224290B2Array substrate, method for fabricating same, and display panelWUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD·Filed 2022·Granted Feb 11, 2025·0 cites·20 claims
- 0760US12471331B2Field effect transistor and preparation method thereof, and semiconductor structureHUAWEI TECH CO LTD·Filed 2022·Granted Nov 11, 2025·0 cites·20 claims
- 0857US12287665B2Clock circuit in a processor integrated circuitHUAWEI TECH CO LTD·Filed 2022·Granted Apr 29, 2025·0 cites·12 claims
- 0956US11694982B2Sidewall wetting barrier for conductive pillarsQUALCOMM INC·Filed 2021·Granted Jul 4, 2023·0 cites·30 claims
- 1052US12221779B2Flushing switch device with automatic pressing stroke detectionTAIWAN NAME PLATE CO LTD·Filed 2023·Granted Feb 11, 2025·0 cites·5 claims
- 1151US12100649B2Package comprising an integrated device with a back side metal layerQUALCOMM INC·Filed 2021·Granted Sep 24, 2024·0 cites·34 claims
- 1251US11804428B2Mixed pad size and pad designQUALCOMM INC·Filed 2020·Granted Oct 31, 2023·0 cites·22 claims
- 1351US2024396227A1Antenna module having antenna in mold layer, and related fabrication methodsQUALCOMM INC·Filed 2023·Application pending·0 cites
- 1450US11189575B1Specialized surface mount device for symmetric heat distribution in packageQUALCOMM INC·Filed 2020·Granted Nov 30, 2021·0 cites·18 claims
- 1549US8042730B2Food menu having electronic labelsTAIWAN NAME PLATE CO LTD·Filed 2008·Granted Oct 25, 2011·0 cites·24 claims
- 1648US2022327070A1Memory Manager, Processor Memory Subsystem, Processor, and Electronic DeviceHUAWEI TECH CO LTD·Filed 2022·Application pending·0 cites
- 1746US2023149246A1Smart walkerTAIWAN NAME PLATE CO LTD·Filed 2022·Application pending·0 cites
- 1845US11545411B2Package comprising wire bonds configured as a heat spreaderQUALCOMM INC·Filed 2020·Granted Jan 3, 2023·0 cites·30 claims
- 1945US2009145971A1Printed wireless rf identification label structureYIN WEN CHENG·Filed 2007·Application pending·0 cites
- 2045US2021380369A1Switch device for elevatorTAIWAN NAME PLATE CO LTD·Filed 2021·Application pending·0 cites
- 2144US11153727B2Push management system of wearable deviceTAIWAN NAME PLATE CO LTD·Filed 2020·Granted Oct 19, 2021·0 cites·12 claims
- 2243US2008174435A1RFID assemblyYIN WEN-CHENG·Filed 2007·Application pending·0 cites
- 2340US2018012243A1Expenditure data systemTAIWAN NAME PLATE CO LTD·Filed 2016·Application pending·0 cites
- 2440US2009140867A1Pressure vessel apparatus with sensing identification functionTAIWAN NAME PLATE CO LTD·Filed 2008·Application pending·0 cites
- 2535US2021409503A1Push notification device of warning areasTAIWAN NAME PLATE CO LTD·Filed 2021·Application pending·0 cites
- 2632US2016375653A1Integrated circuit die transport apparatus and methodsINTEL CORP·Filed 2015·Application pending·0 cites
- 2732US2020125136A1Smart post-it-like system with functional plugTAIWAN NAME PLATE CO LTD·Filed 2019·Application pending·0 cites
- 2830US2018166313A1Thermoplastic elastomer (tpe) adhesive carrier tapeINTEL CORP·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →