Inventor · disambiguated record
Wenhua Zhang
Also filed as: ZHANG WENHUA
7 granted patents·3 pending applications·4 citations·filing 2015–2023
71Inventor score
Top patents by PatentIndex Score
10 records- 0186US9850409B2High temperature debondable adhesiveHenkel IP & Holding GmbH·Filed 2015·Granted Dec 26, 2017·4 cites·15 claims
- 0270US2024026168A1Thermally debondable coating compositions and structures made therefromHENKEL AG & CO KGAA·Filed 2023·Application pending·0 cites
- 0369US11814530B2Stretchable electrically conductive ink compositionsHenkel IP & Holding GmbH·Filed 2021·Granted Nov 14, 2023·0 cites·18 claims
- 0467US11840634B2Stretchable electrically conductive ink compositionsHenkel IP & Holding GmbH·Filed 2021·Granted Dec 12, 2023·0 cites·18 claims
- 0563US10392543B2Reactive resins and formulations for low refractive index and low dielectric constant applicationsHenkel IP & Holding GmbH·Filed 2018·Granted Aug 27, 2019·0 cites·20 claims
- 0660US11339304B2Polymer emulsion as binder for conductive compositionHenkel IP & Holding GmbH·Filed 2018·Granted May 24, 2022·0 cites·26 claims
- 0759US2021206988A1Conductive ink compositionHenkel IP & Holding GmbH·Filed 2021·Application pending·0 cites
- 0852US12234390B2Debondable compositionsHENKEL AG & CO KGAA·Filed 2018·Granted Feb 25, 2025·0 cites·12 claims
- 0950US2018134839A1Monomeric and oligomeric resins for one drop fill sealant applicationHenkel IP & Holding GmbH·Filed 2018·Application pending·0 cites
- 1046US10280349B21K UV and thermal cure high temperature debondable adhesiveHenkel IP & Holding GmbH·Filed 2016·Granted May 7, 2019·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →