Inventor · disambiguated record
Weiwen Zheng
Also filed as: ZHENG WEIWEN
8 granted patents·3 pending applications·320 citations·filing 1997–2024
90Inventor score
Files withUNIV CALIFORNIA9TENCENT TECH SHENZHEN CO LTD1YANGTZE DELTA INDUSTRIAL INNOVATION CENTER OF QUANTUM SCIENCE AND TECH1
Top patents by PatentIndex Score
11 records- 0196US6210707B1Methods of forming protein-linked lipidic microparticles, and compositions thereofUNIV CALIFORNIA·Filed 1998·Granted Apr 3, 2001·146 cites·46 claims
- 0294US7022336B2Methods for attaching proteins to lipidic microparticles with high efficiencyUNIV CALIFORNIA·Filed 2004·Granted Apr 4, 2006·37 cites·16 claims
- 0391US6071533APreparation of stable formulations of lipid-nucleic acid complexes for efficient in vivo deliveryUNIV CALIFORNIA·Filed 1997·Granted Jun 6, 2000·80 cites·18 claims
- 0490US7462603B2Preparation of stable formulations of lipid-nucleic acid complexes for efficient in vivo deliveryUNIV CALIFORNIA·Filed 2005·Granted Dec 9, 2008·5 cites·28 claims
- 0590US6528087B2Kits for forming protein-linked lipidic microparticlesUNIV CALIFORNIA·Filed 2001·Granted Mar 4, 2003·22 cites·8 claims
- 0683US6803053B2Lipidic microparticles linked to multiple proteinsUNIV CALIFORNIA·Filed 2002·Granted Oct 12, 2004·9 cites·13 claims
- 0779US6943027B2Preparation of stable formulations of lipid-nucleic acid complexes for efficient in vivo deliveryUNIV CALIFORNIA·Filed 2002·Granted Sep 13, 2005·6 cites·25 claims
- 0868US2006147513A1Methods of forming targeted liposomes loaded with a therapeutic agentUNIV CALIFORNIA·Filed 2006·Application pending·0 cites
- 0961US6410049B1Preparation of stable formulations of lipid-nucleic acid complexes for efficient in vivo deliveryUNIV CALIFORNIA·Filed 1999·Granted Jun 25, 2002·15 cites·11 claims
- 1056US2025113743A1Josephson junction preparation method and josephson junctionYANGTZE DELTA INDUSTRIAL INNOVATION CENTER OF QUANTUM SCIENCE AND TECH·Filed 2024·Application pending·0 cites
- 1149US2023197572A1Through-silicon-via structure and method for preparing same, through-silicon-via interconnection structure and method for preparing same, and electronic deviceTENCENT TECH SHENZHEN CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →