Inventor · disambiguated record
Wei Zhou
Also filed as: ZHOU WEI · ZHOU WEI-BO
108 granted patents·91 pending applications·589 citations·filing 2001–2025
99Inventor score
Files withMICRON TECHNOLOGY INC84CENTRILLION TECH HOLDINGS CORP32ZHOU WEI8WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD7INNOLUX DISPLAY CORP5
Top patents by PatentIndex Score
199 records- 0198US7485562B2Method of making multichip wafer level packages and computing systems incorporating sameMICRON TECHNOLOGY INC·Filed 2005·Granted Feb 3, 2009·141 cites·18 claims
- 0296US11086157B1Display deviceWUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD·Filed 2020·Granted Aug 10, 2021·6 cites·13 claims
- 0396US8853179B2Reengineering mRNA primary structure for enhanced protein productionMAURO VINCENT P·Filed 2010·Granted Oct 7, 2014·51 cites·1 claims
- 0496US7193312B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2005·Granted Mar 20, 2007·32 cites·13 claims
- 0595US11862591B2Conductive buffer layers for semiconductor die assemblies and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Jan 2, 2024·2 cites·18 claims
- 0695US11810882B2Solder based hybrid bonding for fine pitch and thin BLT interconnectionMICRON TECHNOLOGY INC·Filed 2022·Granted Nov 7, 2023·2 cites·20 claims
- 0794US12315833B2Conductive buffer layers for semiconductor die assemblies and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2023·Granted May 27, 2025·1 cites·20 claims
- 0893US11894327B2Apparatus including integrated segments and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2021·Granted Feb 6, 2024·2 cites·13 claims
- 0993US11756844B2Semiconductor device with a protection mechanism and associated systems, devices, and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Sep 12, 2023·2 cites·17 claims
- 1093US9349670B2Semiconductor die assemblies with heat sink and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2014·Granted May 24, 2016·11 cites·16 claims
- 1193US7468275B2Synthetic internal ribosome entry sites and methods of identifying sameSCRIPPS RESEARCH INST·Filed 2001·Granted Dec 23, 2008·58 cites·31 claims
- 1292US6964881B2Multi-chip wafer level system packages and methods of forming sameMICRON TECHNOLOGY INC·Filed 2002·Granted Nov 15, 2005·51 cites·13 claims
- 1391US10267976B1Backlight module and display deviceWUHAN TIANMA MICRO ELECTRONICS CO LTD·Filed 2018·Granted Apr 23, 2019·22 cites·20 claims
- 1491US9650406B2Reversible terminator molecules and methods of their useCENTRILLION TECH HOLDINGS CORP·Filed 2013·Granted May 16, 2017·24 cites·51 claims
- 1590US11824025B2Apparatus including integrated pads and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2021·Granted Nov 21, 2023·2 cites·20 claims
- 1690US10391467B2Fabrication of patterned arraysCENTRILLION TECH HOLDINGS CORP·Filed 2014·Granted Aug 27, 2019·7 cites·20 claims
- 1790US6825553B2Multichip wafer level packages and computing systems incorporating sameMICRON TECHNOLOGY INC·Filed 2003·Granted Nov 30, 2004·44 cites·26 claims
- 1889US10381329B1Semiconductor device with a layered protection mechanism and associated systems, devices, and methodsMICRON TECHNOLOGY INC·Filed 2018·Granted Aug 13, 2019·5 cites·9 claims
- 1989US10072287B2Methods of targeted sequencingZHOU WEI·Filed 2010·Granted Sep 11, 2018·7 cites·19 claims
- 2088US2025372559A1Solder based hybrid bonding for fine pitch and thin blt interconnectionMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 2187US9664625B2Inspection of substrates using calibration and imagingRUDOLPH TECH INC·Filed 2013·Granted May 30, 2017·6 cites·16 claims
- 2287US8980579B2Chromosomal landing pads and related usesMAURO VINCENT P·Filed 2012·Granted Mar 17, 2015·6 cites·14 claims
- 2386US10475771B2Semiconductor device with an electrically-coupled protection mechanism and associated systems, devices, and methodsMICRON TECHNOLOGY INC·Filed 2018·Granted Nov 12, 2019·4 cites·15 claims
- 2486US9865578B2Methods of manufacturing multi-die semiconductor device packages and related assembliesMICRON TECHNOLOGY INC·Filed 2015·Granted Jan 9, 2018·4 cites·21 claims
- 2586US9689032B2Methods and systems for sequencing long nucleic acidsCENTRILLION TECH HOLDINGS CORP·Filed 2013·Granted Jun 27, 2017·4 cites·26 claims
- 2685US11131600B2Test fixture for aligning center of lensTRIPLE WIN TECH SHENZHEN CO LTD·Filed 2019·Granted Sep 28, 2021·2 cites·6 claims
- 2785US9589933B2Methods of processing wafer-level assemblies to reduce warpage, and related assembliesMICRON TECHNOLOGY INC·Filed 2014·Granted Mar 7, 2017·6 cites·20 claims
- 2884US9202714B2Methods for forming semiconductor device packagesMA ZHAOHUI·Filed 2012·Granted Dec 1, 2015·11 cites·20 claims
- 2983US11410962B2Methods and systems for manufacturing semiconductor devicesMICRON TECHNOLOGY INC·Filed 2020·Granted Aug 9, 2022·1 cites·22 claims
- 3083US10985589B2Method and battery management system for operating a traction battery in a motor vehicle and motor vehicle having such a battery management systemAUDI AG·Filed 2018·Granted Apr 20, 2021·4 cites·9 claims
- 3183US10153178B2Semiconductor die assemblies with heat sink and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Dec 11, 2018·2 cites·18 claims
- 3283US2024429190A1Bond pad with micro-protrusions for direct metallic bondingMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 3382US12394740B2Solder based hybrid bonding for fine pitch and thin BLT interconnectionMICRON TECHNOLOGY INC·Filed 2023·Granted Aug 19, 2025·0 cites·14 claims
- 3482US10017786B2Chromosomal landing pads and related usesSCRIPPS RESEARCH INST·Filed 2015·Granted Jul 10, 2018·2 cites·14 claims
- 3582US9786612B2Methods of processing wafer-level assemblies to reduce warpage, and related assembliesMICRON TECHNOLOGY INC·Filed 2017·Granted Oct 10, 2017·3 cites·20 claims
- 3682US7087992B2Multichip wafer level packages and computing systems incorporating sameMICRON TECHNOLOGY INC·Filed 2004·Granted Aug 8, 2006·21 cites·25 claims
- 3781US10943842B2Semiconductor device with a protection mechanism and associated systems, devices, and methodsMICRON TECHNOLOGY INC·Filed 2020·Granted Mar 9, 2021·1 cites·15 claims
- 3881US10840210B2Methods and systems for manufacturing semiconductor devicesMICRON TECHNOLOGY INC·Filed 2018·Granted Nov 17, 2020·2 cites·11 claims
- 3981US10801062B2Methods and systems for sequencing long nucleic acidsZHOU WEI·Filed 2012·Granted Oct 13, 2020·2 cites·15 claims
- 4081US10103134B2Methods of manufacturing multi-die semiconductor device packages and related assembliesMICRON TECHNOLOGY INC·Filed 2017·Granted Oct 16, 2018·2 cites·20 claims
- 4181US9716019B2Semiconductor die assemblies with heat sink and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2016·Granted Jul 25, 2017·2 cites·23 claims
- 4280US11289360B2Methods and apparatus for protection of dielectric films during microelectronic component processingMICRON TECHNOLOGY INC·Filed 2019·Granted Mar 29, 2022·2 cites·24 claims
- 4380US10059986B2Reversible terminator molecules and methods of their useCENTRILLION TECH HOLDINGS CORP·Filed 2017·Granted Aug 28, 2018·1 cites·20 claims
- 4480US2025279379A1Conductive buffer layers for semiconductor die assemblies and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 4579US10923448B2Bond pad with micro-protrusions for direct metallic bondingMICRON TECHNOLOGY INC·Filed 2017·Granted Feb 16, 2021·2 cites·11 claims
- 4679US7304375B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2005·Granted Dec 4, 2007·5 cites·12 claims
- 4778US12204133B2Backlight module and display panelWUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD·Filed 2024·Granted Jan 21, 2025·0 cites·20 claims
- 4878US10840209B2Methods and systems for manufacturing semiconductor devicesMICRON TECHNOLOGY INC·Filed 2018·Granted Nov 17, 2020·2 cites·14 claims
- 4978US10312226B2Semiconductor devices comprising protected side surfaces and related methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Jun 4, 2019·2 cites·20 claims
- 5078US2025346945A1Oligonucleotide probe array with electronic detection systemCENTRILLION TECH HOLDINGS CORP·Filed 2024·Application pending·0 cites
Showing the top 50 of 199 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →