Inventor · disambiguated record
Wenxi Zhou
Also filed as: ZHOU WENXI
129 granted patents·102 pending applications·74 citations·filing 2019–2025
99Inventor score
Files withYANGTZE MEMORY TECH CO LTD231
Top patents by PatentIndex Score
231 records- 0198US11699659B2Staircase structure in three-dimensional memory device and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Jul 11, 2023·3 cites·20 claims
- 0298US11562945B2Semiconductor device having a spacer structure in a conductive layer and a contact structure in the spacer structureYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jan 24, 2023·7 cites·20 claims
- 0398US11227871B2Three-dimensional memory device and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jan 18, 2022·4 cites·20 claims
- 0497US11862565B2Contact structures for three-dimensional memoryYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jan 2, 2024·4 cites·5 claims
- 0597US11574922B2Three-dimensional memory devicesYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Feb 7, 2023·3 cites·20 claims
- 0697US11380629B2Methods for forming three-dimensional memory devices with supporting structure for staircase regionYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jul 5, 2022·5 cites·20 claims
- 0797US11233007B2Staircase structure in three-dimensional memory device and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jan 25, 2022·4 cites·20 claims
- 0896US12255181B2Methods for forming three-dimensional memory devicesYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Mar 18, 2025·2 cites·20 claims
- 0996US12136586B2Semiconductor devices having a conductive layer stacking with an insulating layer and a spacer structure through the conductive layerYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Nov 5, 2024·2 cites·19 claims
- 1096US12136618B2Three-dimensional memory device with backside source contactYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Nov 5, 2024·2 cites·20 claims
- 1196US12075621B2Three-dimensional memory device and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Aug 27, 2024·2 cites·16 claims
- 1296US11935596B2Three-dimensional memory devices having polysilicon layer and bonded semiconductor structures and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Mar 19, 2024·4 cites·20 claims
- 1395US12020750B2Three-dimensional memory devicesYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Jun 25, 2024·2 cites·17 claims
- 1495US11929119B2Three-dimensional memory devices and memory systemYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Mar 12, 2024·3 cites·18 claims
- 1595US11456290B2Three-dimensional memory device with backside source contactYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Sep 27, 2022·3 cites·20 claims
- 1693US12082408B2Three-dimensional memory devices having first semiconductor structure bonded with second semiconductor structure each including peripheral circuit and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Sep 3, 2024·2 cites·20 claims
- 1792US11735543B2DRAM memory device with xtacking architectureYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Aug 22, 2023·2 cites·20 claims
- 1891US11837541B2Memory device and fabrication method thereofYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Dec 5, 2023·2 cites·20 claims
- 1991US2025344393A1Methods for forming three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2025·Application pending·0 cites
- 2091US2025120086A1Three-dimensional nand memory device and method of forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 2189US11716853B2Method for fabricating three-dimensional memory device by thickening an epitaxial layerYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Aug 1, 2023·2 cites·15 claims
- 2289US11696439B2Staircase structure in three-dimensional memory device and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jul 4, 2023·2 cites·16 claims
- 2389US11508750B2Three-dimensional memory device including a peripheral circuit and a memory stackYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Nov 22, 2022·2 cites·20 claims
- 2488US11812614B2Vertical memory devicesYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Nov 7, 2023·1 cites·20 claims
- 2588US11626416B2Method for forming three-dimensional memory device with backside source contactYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Apr 11, 2023·2 cites·20 claims
- 2688US2024339404A13d nand memory device and method of forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 2788US2025378879A1Three-dimensional memory devices and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2025·Application pending·0 cites
- 2887US12262533B2Dynamic flash memory (DFM) with multi-cellsYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Mar 25, 2025·1 cites·14 claims
- 2987US12046555B23D NAND memory device and method of forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2023·Granted Jul 23, 2024·0 cites·18 claims
- 3087US2025133734A1Staircase structure in three-dimensional memory device and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 3186US12477749B2Three-dimensional memory devices having semiconductor assemblies bonded by bonding layer and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Nov 18, 2025·1 cites·20 claims
- 3286US12033957B2Three-dimensional memory devices and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Jul 9, 2024·1 cites·20 claims
- 3385US12302573B2Three-dimensional memory device with backside interconnect structuresYANGTZE MEMORY TECH CO LTD·Filed 2024·Granted May 13, 2025·0 cites·20 claims
- 3485US12191269B2Three-dimensional memory device and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Jan 7, 2025·1 cites·20 claims
- 3585US12167605B2Vertical memory devicesYANGTZE MEMORY TECH CO LTD·Filed 2023·Granted Dec 10, 2024·0 cites·20 claims
- 3685US12069854B2Three-dimensional memory devices and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Aug 20, 2024·1 cites·20 claims
- 3784US12412628B2Methods for forming three-dimensional memory devicesYANGTZE MEMORY TECH CO LTD·Filed 2024·Granted Sep 9, 2025·0 cites·20 claims
- 3884US11342264B23D NAND memory device and method of forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted May 24, 2022·1 cites·10 claims
- 3983US2023282579A13d nand memory device and method of forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 4082US12402313B2Methods for forming three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2023·Granted Aug 26, 2025·0 cites·20 claims
- 4182US12058858B2Three-dimensional memory devices and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Aug 6, 2024·1 cites·20 claims
- 4282US11393844B2Methods for forming three-dimensional memory devicesYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jul 19, 2022·1 cites·20 claims
- 4382US2024274535A1Staircase structure in three-dimensional memory device and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 4482US2025359011A1Dynamic flash memory (dfm) with ring-type insulator in channel for improved retentionYANGTZE MEMORY TECH CO LTD·Filed 2025·Application pending·0 cites
- 4581US12315802B2Memory device and fabrication method thereofYANGTZE MEMORY TECH CO LTD·Filed 2023·Granted May 27, 2025·0 cites·20 claims
- 4681US12232313B2Staircase structure in three-dimensional memory device and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2023·Granted Feb 18, 2025·0 cites·20 claims
- 4781US12159849B2DRAM memory device with Xtacking architectureYANGTZE MEMORY TECH CO LTD·Filed 2023·Granted Dec 3, 2024·0 cites·20 claims
- 4881US12068250B23D NAND memory device and method of forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Aug 20, 2024·0 cites·16 claims
- 4981US11864388B2Vertical memory devicesYANGTZE MEMORY TECH CO LTD·Filed 2023·Granted Jan 2, 2024·0 cites·20 claims
- 5081US11665892B2Staircase structure in three-dimensional memory device and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted May 30, 2023·1 cites·20 claims
Showing the top 50 of 231 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →