Inventor · disambiguated record
Wei Zou
Also filed as: ZOU WEI · ZOU WEI D Z
10 granted patents·2 pending applications·108 citations·filing 2003–2010
90Inventor score
Top patents by PatentIndex Score
12 records- 0191US8156998B2Patterned metal thermal interfaceFURMAN BRUCE K·Filed 2010·Granted Apr 17, 2012·12 cites·18 claims
- 0290US7694719B2Patterned metal thermal interfaceIBM·Filed 2007·Granted Apr 13, 2010·18 cites·16 claims
- 0389US7268428B2Thermal paste containment for semiconductor modulesIBM·Filed 2005·Granted Sep 11, 2007·25 cites·6 claims
- 0488US7250576B2Chip package having chip extension and methodIBM·Filed 2005·Granted Jul 31, 2007·17 cites·12 claims
- 0577US7898076B2Structure and methods of processing for solder thermal interface materials for chip coolingIBM·Filed 2007·Granted Mar 1, 2011·7 cites·16 claims
- 0673US8531025B2Thermal paste containment for semiconductor modulesEDWARDS DAVID L·Filed 2007·Granted Sep 10, 2013·9 cites·15 claims
- 0772US8021925B2Thermal paste containment for semiconductor modulesIBM·Filed 2007·Granted Sep 20, 2011·9 cites·16 claims
- 0870US7302757B2Micro-bumps to enhance LGA interconnectionsIBM·Filed 2005·Granted Dec 4, 2007·6 cites·10 claims
- 0966US7114240B2Method for fabricating giant magnetoresistive (GMR) devicesHONEYWELL INT INC·Filed 2003·Granted Oct 3, 2006·5 cites·11 claims
- 1046US7383626B2Methods for fabricating giant magnetoresistive (GMR) devicesHONEYWELL INT INC·Filed 2006·Granted Jun 10, 2008·0 cites·5 claims
- 1136US2005106359A1Method of processing substrateHONEYWELL INT INC·Filed 2003·Application pending·0 cites
- 1235US2005221635A1Micro-bumps to enhance lga interconnectionsIBM·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →