Inventor · disambiguated record
Whitney Bryks
Also filed as: BRYKS WHITNEY · BRYKS WHITNEY M · Bryks Whitney Michael
12 granted patents·46 pending applications·3 citations·filing 2015–2024
81Inventor score
Top patents by PatentIndex Score
58 records- 0177US12442979B2Optical waveguide formed within in a glass layerINTEL CORP·Filed 2021·Granted Oct 14, 2025·1 cites·25 claims
- 0269US11804420B2Core-shell particles for magnetic packagingINTEL CORP·Filed 2018·Granted Oct 31, 2023·1 cites·7 claims
- 0369US10546916B2Package-integrated vertical capacitors and methods of assembling sameINTEL CORP·Filed 2018·Granted Jan 28, 2020·1 cites·9 claims
- 0463US11296186B2Package-integrated vertical capacitors and methods of assembling sameINTEL CORP·Filed 2020·Granted Apr 5, 2022·0 cites·12 claims
- 0562US12439826B2Integrated MEMS resonator and methodINTEL CORP·Filed 2021·Granted Oct 7, 2025·0 cites·21 claims
- 0661US2025022786A1Methods and apparatus for edge protected glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 0759US2025391718A1Integrated circuit packages including substrates with reinforced glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 0859US2024123561A1Magnet-driven chemical-mechanical polishingINTEL CORP·Filed 2022·Application pending·0 cites
- 0958US12374482B2Carrier chuck comprising a plurality of magnets and methods of forming and using thereofINTEL CORP·Filed 2022·Granted Jul 29, 2025·0 cites·4 claims
- 1058US2025218962A1Technologies for a stack of components embedded in a substrate coreINTEL CORP·Filed 2023·Application pending·0 cites
- 1158US2025125201A1Package substrates with components included in cavities of glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 1258US2025126814A1Package substrates with components included in cavities of glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 1358US2025125202A1Package substrates with components included in cavities of glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 1458US2025120102A1Package substrates with components included in cavities of glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 1558US2025218881A1Liquid-based method for embedding components in thick substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 1657US12449600B2Position controlled waveguides and methods of manufacturing the sameINTEL CORP·Filed 2021·Granted Oct 21, 2025·0 cites·25 claims
- 1757US2025210426A1Microelectronic assemblies with strengthened glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 1857US2023294204A1Method and apparatus for removing laser debond residue from substrateINTEL CORP·Filed 2022·Application pending·0 cites
- 1956US2025218929A1Embedded deep trench capacitors in integrated circuit device package substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 2055US2025218955A1Microelectronic structures including embedded glass patch with integrated capacitorINTEL CORP·Filed 2023·Application pending·0 cites
- 2155US2025192069A1Microelectronic assemblies with pre-singulation edge features in glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 2254US2025309148A1Substrate with component embedded in a blind cavityINTEL CORP·Filed 2024·Application pending·0 cites
- 2353US2024178146A1Integrated circuit packages including substrates with strengthened glass coresINTEL CORP·Filed 2022·Application pending·0 cites
- 2453US2025210586A1Semiconductor package substrate dicing and edge passivationINTEL CORP·Filed 2023·Application pending·0 cites
- 2553US2024112999A1Layered glass assembly with pre-patterned electrically conductive interconnectsINTEL CORP·Filed 2022·Application pending·0 cites
- 2653US2024113072A1Singulation of integrated circuit package substrates with glass coresINTEL CORP·Filed 2022·Application pending·0 cites
- 2753US2025112136A1Glass core protection using peripheral buffer layersINTEL CORP·Filed 2023·Application pending·0 cites
- 2852US2025219041A1Technologies for memory and power components embedded in a substrate coreINTEL CORP·Filed 2023·Application pending·0 cites
- 2952US2025112163A1Through-glass via liners for integrated circuit device packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 3051US9728500B2Integrated circuit surface layer with adhesion-functional groupINTEL CORP·Filed 2015·Granted Aug 8, 2017·0 cites·13 claims
- 3151US2025112175A1Microelectronic assemblies with edge stress reduction in glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 3251US2024217216A1Ultrathin laminated glass and glass stiffeners for coreless packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 3351US2025183182A1Microelectronic assemblies with through-glass via stress alleviation in glass coresSHAN BOHAN·Filed 2023·Application pending·0 cites
- 3451US2023420348A1Sinx adhesion promoter with adhesion hole features in packaging substrate for reliability performance enhancementINTEL CORP·Filed 2022·Application pending·0 cites
- 3550US2025006623A1Forming porous dielectric structures with spatially-controlled porosityINTEL CORP·Filed 2023·Application pending·0 cites
- 3650US2024327201A1Mems dies embedded in glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 3749US12214579B2Dry film lamination with dynamic feedback controlINTEL CORP·Filed 2022·Granted Feb 4, 2025·0 cites·19 claims
- 3849US2017301619A1Integrated circuit surface layer with adhesion-functional groupINTEL CORP·Filed 2017·Application pending·0 cites
- 3949US2024105476A1System for coating methodINTEL CORP·Filed 2022·Application pending·0 cites
- 4049US2024186197A1Substrate architecture for enhanced electrostatic chuckingINTEL CORP·Filed 2022·Application pending·0 cites
- 4148US2025206659A1Apparatus and system for coating of glass substrate having a plurality of through-holesINTEL CORP·Filed 2023·Application pending·0 cites
- 4248US2024186136A1Polymeric films as an adhesive promotion/buffer layer at glass-dielectric or metal-dielectric interfacesINTEL CORP·Filed 2022·Application pending·0 cites
- 4348US2024213328A1Direct electroplating on modified polymer-graphene compositesINTEL CORP·Filed 2022·Application pending·0 cites
- 4447US2024178157A1Shape memory polymer (smp) glass core package for modulating warpageINTEL CORP·Filed 2022·Application pending·0 cites
- 4547US2024096561A1Thin film capacitorsINTEL CORP·Filed 2022·Application pending·0 cites
- 4647US2024222211A1Ic die packages with low cte dielectric materialsINTEL CORP·Filed 2022·Application pending·0 cites
- 4746US2023207503A1Stress arrest lip on copper pad for low roughness copperINTEL CORP·Filed 2021·Application pending·0 cites
- 4845US11462432B2Dual side de-bonding in component carriers using photoablationINTEL CORP·Filed 2018·Granted Oct 4, 2022·0 cites·20 claims
- 4945US2024186229A1Integrated circuit package architectures with core and/or build-up layers comprising spin-on glass (sog)INTEL CORP·Filed 2022·Application pending·0 cites
- 5045US2023034737A1Composite ic die package including ic die directly bonded to front and back sides of an interposerINTEL CORP·Filed 2021·Application pending·0 cites
Showing the top 50 of 58 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →