Inventor · disambiguated record
William J. Allen
Also filed as: ALLEN WILLIAM · ALLEN WILLIAM J
7 granted patents·10 pending applications·4 citations·filing 2015–2021
73Inventor score
Files withHEWLETT PACKARD DEVELOPMENT CO14HEWLETT- PACKARD DEV COMPANY L P1PERIDOT PRINT LLC1UNIV NANYANG TECH1
Top patents by PatentIndex Score
17 records- 0181US11981084B2Lifecycle condition-based manufacturing alterationHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted May 14, 2024·1 cites·15 claims
- 0281US11969945B2Automated handling based on part identifier and locationHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Apr 30, 2024·1 cites·14 claims
- 0377US11887177B2Part re-order based on part-specific sensor dataHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Jan 30, 2024·1 cites·15 claims
- 0470US10688774B2Processing object part data for a three-dimensionsal objectHEWLETT PACKARD DEVELOPMENT CO·Filed 2015·Granted Jun 23, 2020·1 cites·15 claims
- 0557US11822995B2Resonator-based object pose determinationHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Granted Nov 21, 2023·0 cites·15 claims
- 0653US2022138374A1User-based design file modificationsHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Application pending·0 cites
- 0753US2022118707A1Embedded storage element with print informationHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Application pending·0 cites
- 0853US2022134651A13d printed objects and embedded container structuresHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Application pending·0 cites
- 0953US2022097307A1Sensing manufacturing conditions while 3d printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Application pending·0 cites
- 1053US2022097308A1Storing manufacturing conditions while 3d printingHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Application pending·0 cites
- 1151US2022234289A13d printed objects and enclosed container structuresHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Application pending·0 cites
- 1249US12311605B23D printed object cleaningPERIDOT PRINT LLC·Filed 2020·Granted May 27, 2025·0 cites·14 claims
- 1348US11733020B2First object for assembly with a second object and method of assembly thereofUNIV NANYANG TECH·Filed 2020·Granted Aug 22, 2023·0 cites·18 claims
- 1448US2023191492A1Three-dimensional object physical property deviation determinationHEWLETT PACKARD DEVELOPMENT CO·Filed 2020·Application pending·0 cites
- 1545US2022019193A1Accelerometer-based object pose determinationHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Application pending·0 cites
- 1638US2023067534A13d-printed components with rfid connection detectionHEWLETT PACKARD DEVELOPMENT CO·Filed 2021·Application pending·0 cites
- 1737US2017329878A1Variable density modelingHEWLETT- PACKARD DEV COMPANY L P·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →