Inventor · disambiguated record
William John Antheunisse
Also filed as: ANTHEUNISSE WILLIAM J · ANTHEUNISSE WILLIAM JOHN
3 granted patents·56 citations·filing 1998–2010
72Inventor score
Top patents by PatentIndex Score
3 records- 0193US8344749B2Through carrier dual side loop-back testing of TSV die after die attach to substrateTEXAS INSTRUMENTS INC·Filed 2010·Granted Jan 1, 2013·23 cites·22 claims
- 0278US8471577B2Lateral coupling enabled topside only dual-side testing of TSV die attached to package substrateSTILLMAN DANIEL JOSEPH·Filed 2010·Granted Jun 25, 2013·8 cites·23 claims
- 0355US6289472B1Method and test system for testing under a plurality of test modesTEXAS INSTRUMENTS INC·Filed 1998·Granted Sep 11, 2001·25 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →