Inventor · disambiguated record
William D. Boyd
Also filed as: BOYD WILLIAM D · BOYD WILLIAM DAVID
15 granted patents·5 pending applications·2,147 citations·filing 1987–2019
95Inventor score
Top patents by PatentIndex Score
20 records- 0198US9707004B2Surgical instrumentsETHICON ENDO SURGERY INC·Filed 2015·Granted Jul 18, 2017·216 cites·22 claims
- 0298US9642644B2Surgical instrumentsETHICON ENDO SURGERY INC·Filed 2015·Granted May 9, 2017·227 cites·20 claims
- 0398US8652155B2Surgical instrumentsHOUSER KEVIN L·Filed 2011·Granted Feb 18, 2014·1k cites·11 claims
- 0497US10531910B2Surgical instrumentsETHICON LLC·Filed 2017·Granted Jan 14, 2020·42 cites·21 claims
- 0597US9220527B2Surgical instrumentsETHICON ENDO SURGERY INC·Filed 2014·Granted Dec 29, 2015·247 cites·25 claims
- 0697US8808319B2Surgical instrumentsHOUSER KEVIN L·Filed 2007·Granted Aug 19, 2014·312 cites·21 claims
- 0786US11607268B2Surgical instrumentsCILAG GMBH INT·Filed 2019·Granted Mar 21, 2023·3 cites·16 claims
- 0875US6240814B1Adjustable box wrenchFiled 1999·Granted Jun 5, 2001·30 cites·10 claims
- 0970USD390764SAdjustable box wrenchBOYD BILL E·Filed 1997·Granted Feb 17, 1998·17 cites·1 claims
- 1058US8053285B2Thermally enhanced single inline package (SIP)TEXAS INSTRUMENTS INC·Filed 2009·Granted Nov 8, 2011·1 cites·13 claims
- 1158US7612437B2Thermally enhanced single inline package (SIP)TEXAS INSTRUMENTS INC·Filed 2007·Granted Nov 3, 2009·1 cites·12 claims
- 1254US7084494B2Semiconductor package having integrated metal parts for thermal enhancementTEXAS INSTRUMENTS INC·Filed 2004·Granted Aug 1, 2006·5 cites·16 claims
- 1353USD304669SAdjustable wrenchBOYD WILLIAM D·Filed 1987·Granted Nov 21, 1989·8 cites·1 claims
- 1450US7531895B2Integrated circuit package and method of manufacture thereofTEXAS INSTRUMENTS INC·Filed 2006·Granted May 12, 2009·0 cites·14 claims
- 1547US5988024AAdjustable box wrenchFiled 1997·Granted Nov 23, 1999·12 cites·10 claims
- 1646US2006226521A1Semiconductor Package Having Integrated Metal Parts for Thermal EnhancementCOYLE ANTHONY L·Filed 2006·Application pending·0 cites
- 1745US2006192273A1Integrated circuit package and method of manufacture thereofTEXAS INSTRUMENTS INC·Filed 2005·Application pending·0 cites
- 1841US2008079124A1Interdigitated leadfingersHAGA CHRIS EDWARD·Filed 2007·Application pending·0 cites
- 1939US2005230842A1Multi-chip flip package with substrate for inter-die couplingTEXAS INSTRUMENTS INC·Filed 2004·Application pending·0 cites
- 2037US2005151268A1Wafer-level assembly method for chip-size devices having flipped chipsFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →