Inventor · disambiguated record
William Brezinski
Also filed as: BREZINSKI WILLIAM · BREZINSKI WILLIAM P
5 granted patents·2 pending applications·2 citations·filing 2019–2023
64Inventor score
Files withINTEL CORP7
Top patents by PatentIndex Score
7 records- 0180US11289421B2Methods and structures for improved electrical contact between bonded integrated circuit interfacesINTEL CORP·Filed 2019·Granted Mar 29, 2022·2 cites·20 claims
- 0270US11784123B2Methods and structures for improved electrical contact between bonded integrated circuit interfacesINTEL CORP·Filed 2022·Granted Oct 10, 2023·0 cites·20 claims
- 0365US11887887B2Interconnect structures and methods of fabricationINTEL CORP·Filed 2022·Granted Jan 30, 2024·0 cites·18 claims
- 0457US2025112155A1Conformal coatings with spatially defined surface energies for die-to-wafer self-alignment assisted assemblyINTEL CORP·Filed 2023·Application pending·0 cites
- 0556US2025105046A1Selective layer transferINTEL CORP·Filed 2023·Application pending·0 cites
- 0655US11404307B2Interconnect structures and methods of fabricationINTEL CORP·Filed 2019·Granted Aug 2, 2022·0 cites·18 claims
- 0746US11532558B2Metallization barrier structures for bonded integrated circuit interfacesINTEL CORP·Filed 2019·Granted Dec 20, 2022·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →