Inventor · disambiguated record
William L. Brodsky
Also filed as: BRODSKY WILLIAM · BRODSKY WILLIAM L · BRODSKY WILLIAM LOUIS
155 granted patents·12 pending applications·2,507 citations·filing 1988–2023
99Inventor score
Top patents by PatentIndex Score
167 records- 0198US9717154B2Enclosure with inner tamper-respondent sensor(s)IBM·Filed 2017·Granted Jul 25, 2017·34 cites·18 claims
- 0298US9661747B1Tamper-respondent assemblies with enclosure-to-board protectionIBM·Filed 2016·Granted May 23, 2017·43 cites·15 claims
- 0398US9591776B1Enclosure with inner tamper-respondent sensor(s)IBM·Filed 2015·Granted Mar 7, 2017·39 cites·18 claims
- 0498US9554477B1Tamper-respondent assemblies with enclosure-to-board protectionIBM·Filed 2015·Granted Jan 24, 2017·48 cites·16 claims
- 0597US9911012B2Overlapping, discrete tamper-respondent sensorsIBM·Filed 2015·Granted Mar 6, 2018·14 cites·9 claims
- 0697US9877383B2Tamper-respondent assemblies with enclosure-to-board protectionIBM·Filed 2017·Granted Jan 23, 2018·17 cites·12 claims
- 0797US6386890B1Printed circuit board to module mounting and interconnecting structure and methodIBM·Filed 2001·Granted May 14, 2002·129 cites·22 claims
- 0896US11800666B2Temporary removable module lidIBM·Filed 2021·Granted Oct 24, 2023·4 cites·19 claims
- 0996US9936573B2Tamper-respondent assembliesIBM·Filed 2015·Granted Apr 3, 2018·13 cites·13 claims
- 1096US9924591B2Tamper-respondent assembliesIBM·Filed 2015·Granted Mar 20, 2018·13 cites·20 claims
- 1196US9913362B2Tamper-respondent assemblies with bond protectionIBM·Filed 2015·Granted Mar 6, 2018·13 cites·10 claims
- 1296US9894749B2Tamper-respondent assemblies with bond protectionIBM·Filed 2015·Granted Feb 13, 2018·15 cites·18 claims
- 1396US6665187B1Thermally enhanced lid for multichip modulesIBM·Filed 2002·Granted Dec 16, 2003·108 cites·18 claims
- 1495US10168185B2Circuit boards and electronic packages with embedded tamper-respondent sensorIBM·Filed 2015·Granted Jan 1, 2019·10 cites·8 claims
- 1595US10068451B1Noise level tracking and notification systemIBM·Filed 2017·Granted Sep 4, 2018·14 cites·12 claims
- 1695US7658617B1Plastic land grid array (PLGA) module with inverted hybrid land grid array (LGA) interposerIBM·Filed 2009·Granted Feb 9, 2010·30 cites·20 claims
- 1795US5468917ACircuitized structure including flexible circuit with elastomeric member bonded theretoIBM·Filed 1994·Granted Nov 21, 1995·112 cites·16 claims
- 1894US9893455B1Electrical arc protection using a trip contactIBM·Filed 2016·Granted Feb 13, 2018·15 cites·19 claims
- 1994US9615492B2Electromagnetic gaskets for a cable connectionIBM·Filed 2015·Granted Apr 4, 2017·9 cites·6 claims
- 2094US8267701B2Alignment structure having a frame structure and bridging connections to couple and align segments of a socket housingBEAMAN BRIAN S·Filed 2010·Granted Sep 18, 2012·23 cites·25 claims
- 2194US6540528B2Releasable, repeatable electrical connections employing compressionIBM·Filed 2001·Granted Apr 1, 2003·35 cites·17 claims
- 2294US5984691AFlexible circuitized interposer with apertured member and method for making sameIBM·Filed 1998·Granted Nov 16, 1999·160 cites·10 claims
- 2394US5759047AFlexible circuitized interposer with apertured member and method for making sameIBM·Filed 1996·Granted Jun 2, 1998·169 cites·40 claims
- 2493US9548551B1DIMM connector region vias and routingIBM·Filed 2015·Granted Jan 17, 2017·10 cites·19 claims
- 2593US7709951B2Thermal pillowIBM·Filed 2007·Granted May 4, 2010·27 cites·20 claims
- 2692US8204816B2Method and system for creating and trading derivative investment instruments based on an index of investment management companiesBRODSKY WILLIAM·Filed 2011·Granted Jun 19, 2012·37 cites·20 claims
- 2791US10136519B2Circuit layouts of tamper-respondent sensorsIBM·Filed 2016·Granted Nov 20, 2018·6 cites·12 claims
- 2891US6695623B2Enhanced electrical/mechanical connection for electronic devicesIBM·Filed 2001·Granted Feb 24, 2004·54 cites·10 claims
- 2990US10143090B2Circuit layouts of tamper-respondent sensorsIBM·Filed 2015·Granted Nov 27, 2018·6 cites·19 claims
- 3090US7987584B2Article extraction / insertion tool and assemblyIBM·Filed 2008·Granted Aug 2, 2011·20 cites·16 claims
- 3190US7293994B2Method and apparatus for electrically connecting two substrates using a resilient wire bundle captured in an aperture of an interposer by a retention memberIBM·Filed 2005·Granted Nov 13, 2007·15 cites·13 claims
- 3289US10172232B2Tamper-respondent assemblies with enclosure-to-board protectionIBM·Filed 2017·Granted Jan 1, 2019·4 cites·13 claims
- 3389US7396244B1Apparatus for extracting and inserting a DIMMIBM·Filed 2007·Granted Jul 8, 2008·18 cites·20 claims
- 3489US6722895B1Releasable, repeatable electrical connection employing compressionIBM·Filed 2003·Granted Apr 20, 2004·40 cites·18 claims
- 3589US6679707B1Land grid array connector and method for forming the sameIBM·Filed 2002·Granted Jan 20, 2004·50 cites·23 claims
- 3689US5847324AHigh performance electrical cableIBM·Filed 1996·Granted Dec 8, 1998·65 cites·8 claims
- 3788US10378925B2Circuit boards and electronic packages with embedded tamper-respondent sensorIBM·Filed 2018·Granted Aug 13, 2019·3 cites·9 claims
- 3888US10175064B2Circuit boards and electronic packages with embedded tamper-respondent sensorIBM·Filed 2015·Granted Jan 8, 2019·4 cites·7 claims
- 3988US9444162B1DIMM connector region vias and routingIBM·Filed 2016·Granted Sep 13, 2016·4 cites·1 claims
- 4088US7795724B2Sandwiched organic LGA structureIBM·Filed 2007·Granted Sep 14, 2010·16 cites·12 claims
- 4188US6979782B1Apparatus and method for mechanical coupling of land grid array applicationsIBM·Filed 2005·Granted Dec 27, 2005·15 cites·19 claims
- 4288US6743026B1Printed wiring board thickness control for compression connectors used in electronic packagingIBM·Filed 2003·Granted Jun 1, 2004·41 cites·20 claims
- 4388US5468159APortable external flexible cable and package using sameIBM·Filed 1994·Granted Nov 21, 1995·63 cites·11 claims
- 4486US10331915B2Overlapping, discrete tamper-respondent sensorsIBM·Filed 2017·Granted Jun 25, 2019·3 cites·2 claims
- 4586US7284992B2Electronic package structures using land grid array interposers for module-to-board interconnectionIBM·Filed 2006·Granted Oct 23, 2007·13 cites·14 claims
- 4686US6545226B2Printed wiring board interposer sub-assemblyIBM·Filed 2001·Granted Apr 8, 2003·28 cites·8 claims
- 4786US6037658AElectronic package with heat transfer meansIBM·Filed 1997·Granted Mar 14, 2000·88 cites·40 claims
- 4886US5059129AConnector assembly including bilayered elastomeric memberIBM·Filed 1991·Granted Oct 22, 1991·61 cites·12 claims
- 4985US6375475B1Method and structure for controlled shock and vibration of electrical interconnectsIBM·Filed 2001·Granted Apr 23, 2002·30 cites·6 claims
- 5084US10378924B2Circuit boards and electronic packages with embedded tamper-respondent sensorIBM·Filed 2018·Granted Aug 13, 2019·2 cites·16 claims
Showing the top 50 of 167 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →