Inventor · disambiguated record
William F. Burghout
Also filed as: BURGHOUT WILLIAM · BURGHOUT WILLIAM F
9 granted patents·96 citations·filing 1998–2016
88Inventor score
Files withSEMICONDUCTOR COMPONENTS IND5SEMICONDUCTOR COMPONENTS IND LLC2BURGHOUT WILLIAM F1LETTERMAN JR JAMES P1
Top patents by PatentIndex Score
9 records- 0196US9337098B1Semiconductor die back layer separation methodSEMICONDUCTOR COMPONENTS IND·Filed 2015·Granted May 10, 2016·22 cites·24 claims
- 0292US9484210B2Semiconductor die singulation methodSEMICONDUCTOR COMPONENTS IND LLC·Filed 2015·Granted Nov 1, 2016·7 cites·44 claims
- 0390US8664089B1Semiconductor die singulation methodBURGHOUT WILLIAM F·Filed 2012·Granted Mar 4, 2014·19 cites·20 claims
- 0485US9034733B2Semiconductor die singulation methodSEMICONDUCTOR COMPONENTS IND·Filed 2014·Granted May 19, 2015·5 cites·20 claims
- 0580US9847219B2Semiconductor die singulation methodSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Dec 19, 2017·2 cites·28 claims
- 0670US7588999B2Method of forming a leaded molded array packageSEMICONDUCTOR COMPONENTS IND·Filed 2005·Granted Sep 15, 2009·4 cites·14 claims
- 0767US6081031ASemiconductor package consisting of multiple conductive layersSEMICONDUCTOR COMPONENTS IND·Filed 1998·Granted Jun 27, 2000·27 cites·20 claims
- 0857US8319323B2Electronic package having down-set leads and methodLETTERMAN JR JAMES P·Filed 2004·Granted Nov 27, 2012·10 cites·21 claims
- 0953US7820528B2Method of forming a leaded molded array packageSEMICONDUCTOR COMPONENTS IND·Filed 2009·Granted Oct 26, 2010·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →