Inventor · disambiguated record
William R. Fewer
Also filed as: FEWER WILLIAM R · FEWER WILLIAM RICHARD
5 granted patents·2 pending applications·220 citations·filing 1976–2004
84Inventor score
Top patents by PatentIndex Score
7 records- 0192US4139051AMethod and apparatus for thermally stabilizing workpiecesROCKWELL INTERNATIONAL CORP·Filed 1976·Granted Feb 13, 1979·84 cites·12 claims
- 0278US5440239ATransferable solder bumps for interconnect and assembly of MCM substratesROCKWELL INTERNATIONAL CORP·Filed 1994·Granted Aug 8, 1995·61 cites·20 claims
- 0373US5091288AMethod of forming detector array contact bumps for improved lift off of excess metalROCKWELL INTERNATIONAL CORP·Filed 1989·Granted Feb 25, 1992·50 cites·17 claims
- 0453US6405429B1Microbeam assembly and associated method for integrated circuit interconnection to substratesHONEYWELL INC·Filed 1999·Granted Jun 18, 2002·14 cites·24 claims
- 0543US6297069B1Method for supporting during fabrication mechanical members of semi-conductive dies, wafers, and devices and an associated intermediate device assemblyHONEYWELL INC·Filed 1999·Granted Oct 2, 2001·11 cites·21 claims
- 0637US2005048696A1Microbeam assembly and associated method for integrated circuit interconnection to substratesHONEYWELL INC·Filed 2004·Application pending·0 cites
- 0734US2002036100A1Microbeam assembly for integrated circuit interconnection to substratesHONEYWELL INC·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →