Inventor · disambiguated record
William D. Higdon
Also filed as: HIGDON WILLIAM D · HIGDON WILLIAM DAVID
9 granted patents·2 pending applications·895 citations·filing 1981–2005
92Inventor score
Top patents by PatentIndex Score
11 records- 0196US5115245ASingle substrate microwave radar transceiver including flip-chip integrated circuitsHUGHES AIRCRAFT CO·Filed 1990·Granted May 19, 1992·201 cites·12 claims
- 0294US6281106B1Method of solder bumping a circuit componentDELPHI TECH INC·Filed 1999·Granted Aug 28, 2001·106 cites·21 claims
- 0394US5607099ASolder bump transfer device for flip chip integrated circuit devicesDELCO ELECTRONICS CORP·Filed 1995·Granted Mar 4, 1997·219 cites·6 claims
- 0490US6375062B1Surface bumping method and structure formed therebyDELPHI TECH INC·Filed 2000·Granted Apr 23, 2002·51 cites·11 claims
- 0590US5547740ASolderable contacts for flip chip integrated circuit devicesDELCO ELECTRONICS CORP·Filed 1995·Granted Aug 20, 1996·166 cites·8 claims
- 0681US6251501B1Surface mount circuit device and solder bumping method thereforDELPHI TECH INC·Filed 1999·Granted Jun 26, 2001·66 cites·20 claims
- 0777US5087896AFlip-chip MMIC oscillator assembly with off-chip coplanar waveguide resonant inductorHUGHES AIRCRAFT CO·Filed 1991·Granted Feb 11, 1992·49 cites·26 claims
- 0872US6822327B1Flip-chip interconnected with increased current-carrying capabilityDELPHI TECH INC·Filed 2003·Granted Nov 23, 2004·16 cites·20 claims
- 0963US4400681ASemiconductor pressure sensor with slanted resistorsGEN MOTORS CORP·Filed 1981·Granted Aug 23, 1983·21 cites·7 claims
- 1041US2005046024A1Flip-chip interconnect with increased current-carrying capabilityDELPHI TECH INC·Filed 2004·Application pending·0 cites
- 1140US2007029669A1Integrated circuit with low-stress under-bump metallurgySTEPNIAK FRANK·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →