Inventor · disambiguated record
William Rena Lafontaine, Jr.
Also filed as: LAFONTAINE JR WILLIAM RENA
4 granted patents·117 citations·filing 1995–2000
78Inventor score
Technology areasH10W
Files withIBM4
Top patents by PatentIndex Score
4 records- 0188US6130476ASemiconductor chip package having chip-to-carrier mechanical/electrical connection formed via solid state diffusionIBM·Filed 1995·Granted Oct 10, 2000·85 cites·9 claims
- 0268US6162660AMethod for joining a semiconductor chip to a chip carrier substrate and resulting chip packageIBM·Filed 1995·Granted Dec 19, 2000·28 cites·13 claims
- 0349US6821814B2Method for joining a semiconductor chip to a chip carrier substrate and resulting chip packageIBM·Filed 2000·Granted Nov 23, 2004·3 cites·5 claims
- 0444US6294828B1Semiconductor chip packageIBM·Filed 2000·Granted Sep 25, 2001·1 cites·8 claims
Join the waitlist — get patent alerts
Get an alert when William Rena Lafontaine, Jr. files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →