Inventor · disambiguated record
William A. Lanford
Also filed as: LANFORD WILLIAM A
5 granted patents·168 citations·filing 1994–1998
84Inventor score
Files withUNIV NEW YORK STATE RES FOUND4
Top patents by PatentIndex Score
5 records- 0180US5766379APassivated copper conductive layers for microelectronic applications and methods of manufacturing sameUNIV NEW YORK STATE RES FOUND·Filed 1995·Granted Jun 16, 1998·58 cites·36 claims
- 0275US6057223APassivated copper conductive layers for microelectronic applicationsUNIV NEW YORK STATE RES FOUND·Filed 1998·Granted May 2, 2000·41 cites·20 claims
- 0368US5622608AProcess of making oxidation resistant high conductivity copper layersUNIV NEW YORK STATE RES FOUND·Filed 1994·Granted Apr 22, 1997·35 cites·14 claims
- 0462US5959358AOxidation resistant high conductivity copper layers for microelectronic applications and process of making sameUNIV NEW YORK STATE RES FOUND·Filed 1997·Granted Sep 28, 1999·24 cites·3 claims
- 0549US5689112AApparatus for detection of surface contaminations on silicon wafersFiled 1996·Granted Nov 18, 1997·10 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →