Inventor · disambiguated record
William H. Lytle
Also filed as: LYTLE WILLIAM H
28 granted patents·1 pending application·1,195 citations·filing 1987–2014
97Inventor score
Top patents by PatentIndex Score
29 records- 0196US7741151B2Integrated circuit package formationFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted Jun 22, 2010·54 cites·20 claims
- 0296US7595226B2Method of packaging an integrated circuit dieFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Sep 29, 2009·65 cites·20 claims
- 0396US5391285AAdjustable plating cell for uniform bump plating of semiconductor wafersMOTOROLA INC·Filed 1994·Granted Feb 21, 1995·193 cites·19 claims
- 0493US6953985B2Wafer level MEMS packagingFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Oct 11, 2005·127 cites·29 claims
- 0591US5912510ABonding structure for an electronic deviceMOTOROLA INC·Filed 1996·Granted Jun 15, 1999·94 cites·16 claims
- 0690US7442581B2Flexible carrier and release method for high volume electronic package fabricationFREESCALE SEMICONDUCTOR INC·Filed 2004·Granted Oct 28, 2008·54 cites·25 claims
- 0788US5593903AMethod of forming contact pads for wafer level testing and burn-in of semiconductor diceMOTOROLA INC·Filed 1996·Granted Jan 14, 1997·128 cites·22 claims
- 0886US6974776B2Activation plate for electroless and immersion plating of integrated circuitsFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Dec 13, 2005·49 cites·16 claims
- 0985US7838420B2Method for forming a packaged semiconductor deviceFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Nov 23, 2010·10 cites·13 claims
- 1085US5587342AMethod of forming an electrical interconnectMOTOROLA INC·Filed 1995·Granted Dec 24, 1996·93 cites·16 claims
- 1182US9107303B2Warp compensated electronic assembliesFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Aug 11, 2015·5 cites·15 claims
- 1282US8327532B2Method for releasing a microelectronic assembly from a carrier substrateXU JIANWEN·Filed 2009·Granted Dec 11, 2012·8 cites·18 claims
- 1382US7078796B2Corrosion-resistant copper bond pad and integrated deviceFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Jul 18, 2006·41 cites·27 claims
- 1481US7969026B2Flexible carrier for high volume electronic package fabricationFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted Jun 28, 2011·8 cites·16 claims
- 1580US8829661B2Warp compensated package and methodLYTLE WILLIAM H·Filed 2006·Granted Sep 9, 2014·11 cites·18 claims
- 1678US5411400AInterconnect system for a semiconductor chip and a substrateMOTOROLA INC·Filed 1994·Granted May 2, 1995·63 cites·19 claims
- 1778US4787958AMethod of chemically etching TiW and/or TiWNMOTOROLA INC·Filed 1987·Granted Nov 29, 1988·50 cites·5 claims
- 1875US5674780AMethod of forming an electrically conductive polymer bump over an aluminum electrodeMOTOROLA INC·Filed 1995·Granted Oct 7, 1997·50 cites·20 claims
- 1974US9142434B2Method for singulating electronic components from a substrateGAO WEI·Filed 2008·Granted Sep 22, 2015·4 cites·7 claims
- 2062US7802359B2Electronic assembly manufacturing methodFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Sep 28, 2010·2 cites·19 claims
- 2158US6302775B1Apparatus and method for cold cross-sectioning of soft materialsMOTOROLA INC·Filed 2000·Granted Oct 16, 2001·8 cites·47 claims
- 2257US8415203B2Method of forming a semiconductor package including two devicesBURCH KENNETH R·Filed 2008·Granted Apr 9, 2013·2 cites·21 claims
- 2357US5028454AElectroless plating of portions of semiconductor devices and the likeMOTOROLA INC·Filed 1989·Granted Jul 2, 1991·22 cites·19 claims
- 2453US6949398B2Low cost fabrication and assembly of lid for semiconductor devicesFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Sep 27, 2005·8 cites·43 claims
- 2551US5072873ADevice for solder removalMOTOROLA INC·Filed 1990·Granted Dec 17, 1991·20 cites·18 claims
- 2647US7820485B2Method of forming a package with exposed component surfacesFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted Oct 26, 2010·0 cites·17 claims
- 2743US4946376ABackside metallization scheme for semiconductor devicesMOTOROLA INC·Filed 1989·Granted Aug 7, 1990·14 cites·11 claims
- 2843US2008182363A1Method for forming a microelectronic assembly including encapsulating a die using a sacrificial layerFREESCALE SEMICONDUCTOR INC·Filed 2007·Application pending·0 cites
- 2941US5409567AMethod of etching copper layersMOTOROLA INC·Filed 1994·Granted Apr 25, 1995·12 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →