Inventor · disambiguated record
William G. Mcdonald
Also filed as: MCDONALD WILLIAM · MCDONALD WILLIAM G
23 granted patents·2 pending applications·470 citations·filing 1977–2012
96Inventor score
Top patents by PatentIndex Score
25 records- 0196US7109055B2Methods and apparatus having wafer level chip scale package for sensing elementsFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Sep 19, 2006·60 cites·20 claims
- 0295US8359927B2Molded differential PRT pressure sensorFREESCALE SEMICONDUCTOR INC·Filed 2009·Granted Jan 29, 2013·41 cites·20 claims
- 0394US7261003B2Flowmeter and method for the making thereofFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Aug 28, 2007·27 cites·18 claims
- 0493US7900521B2Exposed pad backside pressure sensor packageFREESCALE SEMICONDUCTOR INC·Filed 2009·Granted Mar 8, 2011·28 cites·20 claims
- 0590US8476087B2Methods for fabricating sensor device package using a sealing structureHOOPER STEPHEN R·Filed 2011·Granted Jul 2, 2013·14 cites·19 claims
- 0686US7437951B2Method of using a differential pressure type flowmeterFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Oct 21, 2008·35 cites·10 claims
- 0786US4126213ACollapsible suitcaseMCDONALD WILLIAM G·Filed 1977·Granted Nov 21, 1978·57 cites·4 claims
- 0885US8742555B2Lead frame having a flag with in-plane and out-of-plane mold locking featuresWEN JIAN·Filed 2011·Granted Jun 3, 2014·8 cites·15 claims
- 0984US9146170B2Capacitive pressure sensor in an overmolded packageWEN JIAN·Filed 2012·Granted Sep 29, 2015·7 cites·18 claims
- 1084US8384168B2Sensor device with sealing structureFREESCALE SEMICONDUCTOR INC·Filed 2011·Granted Feb 26, 2013·8 cites·20 claims
- 1183US7489026B2Methods and apparatus for a Quad Flat No-Lead (QFN) packageFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Feb 10, 2009·9 cites·23 claims
- 1283US7316965B2Substrate contact for a capped MEMS and method of making the substrate contact at the wafer levelFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Jan 8, 2008·13 cites·18 claims
- 1381US8686550B2Method and apparatus for high pressure sensor deviceMCDONALD WILLIAM G·Filed 2012·Granted Apr 1, 2014·9 cites·8 claims
- 1480US8307714B1Dual port pressure sensorHOOPER STEPHEN R·Filed 2011·Granted Nov 13, 2012·7 cites·20 claims
- 1580US6769319B2Component having a filterFREESCALE SEMICONDUCTOR INC·Filed 2001·Granted Aug 3, 2004·37 cites·30 claims
- 1677US6683370B1Semiconductor component and method of manufacturing sameMOTOROLA INC·Filed 2003·Granted Jan 27, 2004·25 cites·29 claims
- 1776US7014888B2Method and structure for fabricating sensors with a sacrificial gel domeFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Mar 21, 2006·25 cites·17 claims
- 1870US7652357B2Quad flat no-lead (QFN) packagesFREESCALE SEMICONDUCTOR INC·Filed 2009·Granted Jan 26, 2010·3 cites·20 claims
- 1966US7713781B2Methods for forming quad flat no-lead (QFN) packagesFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted May 11, 2010·2 cites·20 claims
- 2062US5074621AChair back seat constructionSYSTEMS FURNITURE COMPANY·Filed 1989·Granted Dec 24, 1991·31 cites·4 claims
- 2160US9021689B2Method of making a dual port pressure sensorHOOPER STEPHEN R·Filed 2011·Granted May 5, 2015·1 cites·20 claims
- 2258USD461612SShopping cartRTS PLASTICS INC·Filed 2001·Granted Aug 13, 2002·13 cites·1 claims
- 2348US2011173910A1Composite roofing boards and methods for installing a composite roofing boardPACTIV CORP·Filed 2010·Application pending·0 cites
- 2443US6177727B1Saddle bracket for solid state pressure gaugeMOTOROLA INC·Filed 1998·Granted Jan 23, 2001·10 cites·8 claims
- 2538US2006286706A1Method of making a substrate contact for a capped MEMS at the package levelSALIAN ARVIND S·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →