Inventor · disambiguated record
William B. Mullen, Iii
Also filed as: MULLEN III WILLIAM B · MULLEN III WILLIAM BOONE
29 granted patents·1,806 citations·filing 1984–2000
98Inventor score
Files withMOTOROLA INC29
Top patents by PatentIndex Score
29 records- 0197US5241133ALeadless pad array chip carrierMOTOROLA INC·Filed 1992·Granted Aug 31, 1993·298 cites·11 claims
- 0297US5024372AMethod of making high density solder bumps and a substrate socket for high density solder bumpsMOTOROLA INC·Filed 1990·Granted Jun 18, 1991·221 cites·6 claims
- 0394US5311059ABackplane grounding for flip-chip integrated circuitMOTOROLA INC·Filed 1992·Granted May 10, 1994·198 cites·16 claims
- 0492US5293067AIntegrated circuit chip carrierMOTOROLA INC·Filed 1992·Granted Mar 8, 1994·142 cites·14 claims
- 0591US5761093AQuality forecasting engineMOTOROLA INC·Filed 1997·Granted Jun 2, 1998·81 cites·8 claims
- 0690US5734343AOne-way optical highway communication systemMOTOROLA INC·Filed 1996·Granted Mar 31, 1998·133 cites·12 claims
- 0788US5280139ASelectively releasing conductive runner and substrate assemblyMOTOROLA INC·Filed 1992·Granted Jan 18, 1994·101 cites·10 claims
- 0885US5177134ATacking agentMOTOROLA INC·Filed 1990·Granted Jan 5, 1993·47 cites·13 claims
- 0983US5446625AChip carrier having copper pattern plated with gold on one surface and devoid of gold on another surfaceMOTOROLA INC·Filed 1994·Granted Aug 29, 1995·74 cites·3 claims
- 1082US6242802B1Moisture enhanced ball grid array packageMOTOROLA INC·Filed 1995·Granted Jun 5, 2001·72 cites·5 claims
- 1182US5774341ASolderless electrical interconnection including metallized hook and loop fastenersMOTOROLA INC·Filed 1995·Granted Jun 30, 1998·68 cites·26 claims
- 1282US5427865AMultiple alloy solder preformMOTOROLA INC·Filed 1994·Granted Jun 27, 1995·52 cites·11 claims
- 1380US6307304B1Switch systemMOTOROLA INC·Filed 2000·Granted Oct 23, 2001·27 cites·12 claims
- 1474US5540379ASoldering processMOTOROLA INC·Filed 1994·Granted Jul 30, 1996·37 cites·22 claims
- 1574US4889275AMethod for effecting solder interconnectsMOTOROLA INC·Filed 1988·Granted Dec 26, 1989·31 cites·8 claims
- 1668US5977690APiezoelectric switch apparatus for a communication deviceMOTOROLA INC·Filed 1997·Granted Nov 2, 1999·21 cites·22 claims
- 1764US6060817ASwitching method using a frequency domain piezoelectric switchMOTOROLA INC·Filed 1998·Granted May 9, 2000·19 cites·11 claims
- 1862US6104119APiezoelectric switchMOTOROLA INC·Filed 1999·Granted Aug 15, 2000·18 cites·1 claims
- 1959US4598972AHigh density electrical leadMOTOROLA INC·Filed 1985·Granted Jul 8, 1986·21 cites·2 claims
- 2058US5694296AMultipoint electrical interconnection having deformable J-hooksMOTOROLA INC·Filed 1995·Granted Dec 2, 1997·19 cites·11 claims
- 2156US5184768ASolder interconnection verificationMOTOROLA INC·Filed 1990·Granted Feb 9, 1993·19 cites·28 claims
- 2256US4626309ASelective bonding interconnection maskMOTOROLA INC·Filed 1984·Granted Dec 2, 1986·16 cites·7 claims
- 2355US4586764AElectrical subassembly structureMOTOROLA INC·Filed 1985·Granted May 6, 1986·18 cites·3 claims
- 2452US5435481ASoldering processMOTOROLA INC·Filed 1994·Granted Jul 25, 1995·18 cites·10 claims
- 2552US4752244AZero insertion force edge clip interconnect pinMOTOROLA INC·Filed 1987·Granted Jun 21, 1988·17 cites·3 claims
- 2645US4878851AElectrical socket apparatus with temporary housingMOTOROLA INC·Filed 1989·Granted Nov 7, 1989·10 cites·4 claims
- 2745US4877569AMethod of making a one-piece injection molded battery contact assemblyMOTOROLA INC·Filed 1988·Granted Oct 31, 1989·10 cites·2 claims
- 2844US5623127ASingle alloy solder clad substrateMOTOROLA INC·Filed 1994·Granted Apr 22, 1997·10 cites·16 claims
- 2937US5338391AMethod of making a substrate having selectively releasing conductive runnersMOTOROLA INC·Filed 1993·Granted Aug 16, 1994·8 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →