Inventor · disambiguated record
William Nevin
Also filed as: NEVIN WILLIAM · NEVIN WILLIAM A · NEVIN WILLIAM ANDREW · NEVIN WILLIAM S
7 granted patents·7 pending applications·141 citations·filing 1977–2017
87Inventor score
Files withANALOG DEVICES INC4NEVIN WILLIAM A2KANEGAFUCHI CHEMICAL IND1NEVIN WILLIAM1NEVIN WILLIAM ANDREW1
Top patents by PatentIndex Score
14 records- 0184US10297502B2Isolation structure for micro-transfer-printable devicesX CELEPRINT LTD·Filed 2017·Granted May 21, 2019·4 cites·13 claims
- 0282US6841848B2Composite semiconductor wafer and a method for forming the composite semiconductor waferANALOG DEVICES INC·Filed 2003·Granted Jan 11, 2005·43 cites·37 claims
- 0374US4240783ACombined display container, cigarette lighter, candle holderNEVIN WILLIAM·Filed 1977·Granted Dec 23, 1980·36 cites·4 claims
- 0471US6955988B2Method of forming a cavity and SOI in a semiconductor substrateANALOG DEVICES INC·Filed 2003·Granted Oct 18, 2005·19 cites·47 claims
- 0563US7153757B2Method for direct bonding two silicon wafers for minimising interfacial oxide and stresses at the bond interface, and an SOI structureANALOG DEVICES INC·Filed 2003·Granted Dec 26, 2006·11 cites·12 claims
- 0663US7122416B2Method for forming a filled trench in a semiconductor layer of a semiconductor substrate, and a semiconductor substrate with a semiconductor layer having a filled trench thereinANALOG DEVICES INC·Filed 2003·Granted Oct 17, 2006·13 cites·39 claims
- 0759US4965225AMethod of stabilizing amorphous semiconductorsKANEGAFUCHI CHEMICAL IND·Filed 1989·Granted Oct 23, 1990·15 cites·7 claims
- 0852US2003130873A1Health care provider information systemFiled 2001·Application pending·0 cites
- 0949US2008026230A1Method for bonding a pair of silicon wafers together, and a semiconductor waferNEVIN WILLIAM A·Filed 2007·Application pending·0 cites
- 1045US2006030123A1Method for bonding a pair of silicon wafers together, and a semiconductor waferNEVIN WILLIAM A·Filed 2005·Application pending·0 cites
- 1138US2005048737A1Method for bonding a pair of silicon wafers together, and a semiconductor waferFiled 2004·Application pending·0 cites
- 1237US2009309190A1Semiconductor processingNEVIN WILLIAM ANDREW·Filed 2007·Application pending·0 cites
- 1336US2003148592A1Method for bonding a pair of silicon wafers together, and a semiconductor waferFiled 2002·Application pending·0 cites
- 1436US2005255677A1Integrated circuit with impurity barrierWEIGOLD JASON W·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →