Inventor · disambiguated record
William C. Robinette, Jr.
Also filed as: ROBINETTE JR WILLIAM C · ROBINETTE WILLIAM C
9 granted patents·519 citations·filing 1992–2000
92Inventor score
Top patents by PatentIndex Score
9 records- 0192US5998859APackaging and interconnect system for integrated circuitsMICROMODULE SYSTEMS INC·Filed 1995·Granted Dec 7, 1999·135 cites·4 claims
- 0288US5422514APackaging and interconnect system for integrated circuitsMICROMODULE SYSTEMS INC·Filed 1993·Granted Jun 6, 1995·93 cites·13 claims
- 0383US5402077ABare die carrierMICROMODULE SYSTEMS INC·Filed 1992·Granted Mar 28, 1995·73 cites·26 claims
- 0473US5796164APackaging and interconnect system for integrated circuitsMICROMODULE SYSTEMS INC·Filed 1996·Granted Aug 18, 1998·55 cites·36 claims
- 0570US5508558AHigh density, high speed, semiconductor interconnect using-multilayer flexible substrate with unsupported central portionDIGITAL EQUIPMENT CORP·Filed 1993·Granted Apr 16, 1996·43 cites·17 claims
- 0670US5456404AMethod of testing semiconductor chips with reusable test packageDIGITAL EQUIPMENT CORP·Filed 1993·Granted Oct 10, 1995·47 cites·12 claims
- 0767US6085415AMethods to produce insulated conductive through-features in core materials for electric packagingORMET CORP·Filed 1998·Granted Jul 11, 2000·42 cites·31 claims
- 0864US6937044B1Bare die carrierKULICKE & SOFFA IND INC·Filed 2000·Granted Aug 30, 2005·12 cites·28 claims
- 0955US6049215ABare die carrierKULICKE & SOFFA IND INC·Filed 1995·Granted Apr 11, 2000·19 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →