Inventor · disambiguated record
William Boyd Rogers
Also filed as: ROGERS WILLIAM B · ROGERS WILLIAM BOYD
10 granted patents·1 pending application·71 citations·filing 1976–2018
87Inventor score
Top patents by PatentIndex Score
11 records- 0193US9159547B2Two step method of rapid curing a semiconductor polymer layerDECA TECHNOLOGIES INC·Filed 2013·Granted Oct 13, 2015·20 cites·9 claims
- 0289US10050004B2Fully molded peripheral package on package deviceDECA TECHNOLOGIES INC·Filed 2016·Granted Aug 14, 2018·8 cites·20 claims
- 0379US6793792B2Electroplating methods including maintaining a determined electroplating voltage and related systemsUNITIVE INT LTD·Filed 2002·Granted Sep 21, 2004·16 cites·36 claims
- 0477US9640495B2Semiconductor device processing method for material removalDECA TECHNOLOGIES INC·Filed 2016·Granted May 2, 2017·3 cites·20 claims
- 0572US9613830B2Fully molded peripheral package on package deviceDECA TECHNOLOGIES INC·Filed 2016·Granted Apr 4, 2017·2 cites·20 claims
- 0667US10600652B2Semiconductor device processing method for material removalDECA TECHNOLOGIES INC·Filed 2017·Granted Mar 24, 2020·1 cites·20 claims
- 0753US4846377ALimp, porous membrane for a fluidized outletACF IND INC·Filed 1987·Granted Jul 11, 1989·16 cites·4 claims
- 0847US10672624B2Method of making fully molded peripheral package on package deviceDECA TECHNOLOGIES INC·Filed 2018·Granted Jun 2, 2020·0 cites·21 claims
- 0941US10204803B2Two step method of rapid curing a semiconductor polymer layerDECA TECHNOLOGIES INC·Filed 2015·Granted Feb 12, 2019·0 cites·25 claims
- 1037US2017221830A1Fully molded peripheral package on package deviceDECA TECHNOLOGIES INC·Filed 2017·Application pending·0 cites
- 1127US4031907AHair curling apparatusROGERS WILLIAM B·Filed 1976·Granted Jun 28, 1977·5 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →