Inventor · disambiguated record
Wing Siu
Also filed as: SIU WING H · SIU WING M · SIU WING MING
3 granted patents·9 pending applications·147 citations·filing 2001–2009
77Inventor score
Files withCONVERGENCE TECHNOLOGIES LTD3CONVERGENCE TECHNOLOGIES USA L2CONVERGENCE TECHNOLOGIES INC1COVERGENCE TECHNOLOGIES LTD1EMOTIV SYSTEMS PTY LTD1
Top patents by PatentIndex Score
12 records- 0190US7650931B2Vapor augmented heatsink with multi-wick structureCOVERGENCE TECHNOLOGIES LTD·Filed 2008·Granted Jan 26, 2010·32 cites·18 claims
- 0289US7422053B2Vapor augmented heatsink with multi-wick structureCONVERGENCE TECHNOLOGIES USA L·Filed 2005·Granted Sep 9, 2008·31 cites·25 claims
- 0387US6664617B2Semiconductor packageCONVERGENCE TECHNOLOGIES LTD·Filed 2001·Granted Dec 16, 2003·84 cites·5 claims
- 0459US2010078153A1Vapor Augmented Heatsink with Multi-Wick StructureCONVERGENCE TECHNOLOGIES USA L·Filed 2009·Application pending·0 cites
- 0547US2010018678A1Vapor Chamber with Boiling-Enhanced Multi-Wick StructureCONVERGENCE TECHNOLOGIES LTD·Filed 2009·Application pending·0 cites
- 0641US2006196640A1Vapor chamber with boiling-enhanced multi-wick structureCONVERGENCE TECHNOLOGIES LTD·Filed 2005·Application pending·0 cites
- 0739US2004011509A1Vapor augmented heatsink with multi-wick structureFiled 2003·Application pending·0 cites
- 0836US2007012429A1Heat Transfer DeviceCONVERGENCE TECHNOLOGIES INC·Filed 2006·Application pending·0 cites
- 0936US2007173733A1Detection of and Interaction Using Mental StatesEMOTIV SYSTEMS PTY LTD·Filed 2006·Application pending·0 cites
- 1031US2002195231A1Laminated heat transfer device and method of producing thereofFiled 2002·Application pending·0 cites
- 1131US2004178517A9Split body peltier device for cooling and power generation applicationsFiled 2002·Application pending·0 cites
- 1230US2002144809A1Laminated heat transfer device and method of producing thereofFiled 2002·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Wing Siu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →