Inventor · disambiguated record
William A. Syverson
Also filed as: SYVERSON WILLIAM · SYVERSON WILLIAM A · SYVERSON WILLIAM ALFRED
17 granted patents·1 pending application·425 citations·filing 1992–2004
95Inventor score
Files withIBM18
Top patents by PatentIndex Score
18 records- 0191US6776171B2Cleaning of semiconductor wafers by contaminate encapsulationIBM·Filed 2001·Granted Aug 17, 2004·43 cites·7 claims
- 0287US6276370B1Sonic cleaning with an interference signalIBM·Filed 1999·Granted Aug 21, 2001·90 cites·48 claims
- 0383US5427622AMethod for uniform cleaning of wafers using megasonic energyIBM·Filed 1994·Granted Jun 27, 1995·64 cites·5 claims
- 0477US5294570AReduction of foreign particulate matter on semiconductor wafersIBM·Filed 1992·Granted Mar 15, 1994·66 cites·15 claims
- 0575US5533540AApparatus for uniform cleaning of wafers using megasonic energyIBM·Filed 1995·Granted Jul 9, 1996·37 cites·14 claims
- 0673US6783599B2Method of cleaning contaminants from the surface of a substrateIBM·Filed 2001·Granted Aug 31, 2004·16 cites·32 claims
- 0772US5579792AApparatus for uniform cleaning of wafers using megasonic energyIBM·Filed 1996·Granted Dec 3, 1996·32 cites·15 claims
- 0871US6875286B2Solid CO2 cleaningIBM·Filed 2002·Granted Apr 5, 2005·15 cites·10 claims
- 0963US7081208B2Method to build a microfilterIBM·Filed 2002·Granted Jul 25, 2006·9 cites·3 claims
- 1058US6565666B1Capillary dry process and apparatusIBM·Filed 2000·Granted May 20, 2003·6 cites·11 claims
- 1155US6000418AIntegrated dynamic fluid mixing apparatus and methodIBM·Filed 1997·Granted Dec 14, 1999·21 cites·17 claims
- 1247US6356653B2Method and apparatus for combined particle location and removalIBM·Filed 1998·Granted Mar 12, 2002·16 cites·34 claims
- 1345US7531059B2Cleaning of semiconductor wafers by contaminate encapsulationIBM·Filed 2004·Granted May 12, 2009·0 cites·5 claims
- 1445US6939408B1Method for surface preparation of workpieces utilizing fluid separation techniquesIBM·Filed 2000·Granted Sep 6, 2005·3 cites·4 claims
- 1538US6634371B2Apparatus for removing contaminants from a workpiece using a chemically reactive additiveIBM·Filed 2001·Granted Oct 21, 2003·0 cites·8 claims
- 1637US2003196679A1Process and apparatus for contacting a precision surface with liquid or supercritical carbon dioxideIBM·Filed 2002·Application pending·0 cites
- 1734US5966631AForced plug processing for high aspect ratio structuresIBM·Filed 1997·Granted Oct 12, 1999·4 cites·19 claims
- 1831US6355111B1Method for removing contaminants from a workpiece using a chemically reactive additiveIBM·Filed 1999·Granted Mar 12, 2002·3 cites·26 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →