Inventor · disambiguated record
Willi Volksen
Also filed as: VOLKSEN WILLI
79 granted patents·5 pending applications·1,148 citations·filing 1976–2020
99Inventor score
Files withIBM54CALIFORNIA INST OF TECHN5CHA JENNIFER NAM4HITACHI GLOBAL STORAGE NETHERL4DUBOIS GERAUD JEAN-MICHEL3
Top patents by PatentIndex Score
84 records- 0197US7056840B2Direct photo-patterning of nanoporous organosilicates, and method of useIBM·Filed 2003·Granted Jun 6, 2006·153 cites·26 claims
- 0296US6107357ADielectric compositions and method for their manufactureIBM·Filed 1999·Granted Aug 22, 2000·124 cites·57 claims
- 0394US6541865B2Porous dielectric material and electronic devices fabricated therewithIBM·Filed 2001·Granted Apr 1, 2003·42 cites·12 claims
- 0494US6093636AProcess for manufacture of integrated circuit device using a matrix comprising porous high temperature thermosetsIBM·Filed 1998·Granted Jul 25, 2000·158 cites·20 claims
- 0593US4123396AImpregnated metal-polymeric functional beadsCALIFORNIA INST OF TECHN·Filed 1976·Granted Oct 31, 1978·54 cites·7 claims
- 0692US7229934B2Porous organosilicates with improved mechanical propertiesIBM·Filed 2005·Granted Jun 12, 2007·21 cites·47 claims
- 0792US6342454B1Electronic devices with dielectric compositions and method for their manufactureIBM·Filed 1999·Granted Jan 29, 2002·67 cites·34 claims
- 0891US8314005B2Homogeneous porous low dielectric constant materialsPURUSHOTHAMAN SAMPATH·Filed 2011·Granted Nov 20, 2012·12 cites·13 claims
- 0990US9994741B2Enhanced adhesive materials and processes for 3D applicationsHEDRICK JAMES L·Filed 2015·Granted Jun 12, 2018·7 cites·5 claims
- 1089US8492239B2Homogeneous porous low dielectric constant materialsBRUCE ROBERT L·Filed 2012·Granted Jul 23, 2013·10 cites·20 claims
- 1189US8470706B2Methods to mitigate plasma damage in organosilicate dielectricsARNOLD JOHN C·Filed 2012·Granted Jun 25, 2013·8 cites·15 claims
- 1288US8828489B2Homogeneous modification of porous filmsDUBOIS GERAUD JEAN-MICHEL·Filed 2011·Granted Sep 9, 2014·11 cites·20 claims
- 1388US7459183B2Method of forming low-K interlevel dielectric layers and structuresIBM·Filed 2005·Granted Dec 2, 2008·7 cites·1 claims
- 1484US9058983B2In-situ hardmask generationIBM·Filed 2013·Granted Jun 16, 2015·6 cites·26 claims
- 1584US8481423B2Methods to mitigate plasma damage in organosilicate dielectricsARNOLD JOHN C·Filed 2007·Granted Jul 9, 2013·8 cites·20 claims
- 1684US6685983B2Defect-free dielectric coatings and preparation thereof using polymeric nitrogenous porogensIBM·Filed 2001·Granted Feb 3, 2004·27 cites·34 claims
- 1783US9214335B2Surface plasma modification of porous thin-films to optimize pore fillingIBM·Filed 2014·Granted Dec 15, 2015·6 cites·20 claims
- 1883US4197220AImpregnated metal-polymeric functional beadsCALIFORNIA INST OF TECHN·Filed 1978·Granted Apr 8, 1980·24 cites·8 claims
- 1982US9766170B2Determination of young'S modulus of porous thin films using ultra-low load nano-indentationIBM·Filed 2015·Granted Sep 19, 2017·3 cites·19 claims
- 2082US8541301B2Reduction of pore fill material dewettingDUBOIS GERAUD JEAN-MICHEL·Filed 2011·Granted Sep 24, 2013·5 cites·16 claims
- 2182US7341788B2Materials having predefined morphologies and methods of formation thereofIBM·Filed 2005·Granted Mar 11, 2008·8 cites·9 claims
- 2282US6670285B2Nitrogen-containing polymers as porogens in the preparation of highly porous, low dielectric constant materialsIBM·Filed 2001·Granted Dec 30, 2003·41 cites·30 claims
- 2375US11174412B2Surface modification by polymer anchoring on porous substratesIBM·Filed 2019·Granted Nov 16, 2021·0 cites·20 claims
- 2474US4259223ACross-linked polyvinyl pyridine coated glass particle catalyst support and aqueous composition or polyvinyl pyridine adducted microspheresCALIFORNIA INST OF TECHN·Filed 1978·Granted Mar 31, 1981·21 cites·9 claims
- 2572US5310625AProcess for forming negative tone images of polyimides using base treatment of crosslinked polyamic esterIBM·Filed 1993·Granted May 10, 1994·24 cites·4 claims
- 2671US5953627AProcess for manufacture of integrated circuit deviceIBM·Filed 1997·Granted Sep 14, 1999·40 cites·8 claims
- 2770US6177360B1Process for manufacture of integrated circuit deviceIBM·Filed 1997·Granted Jan 23, 2001·39 cites·17 claims
- 2869US11498063B2Selectively functionalized porous materialIBM·Filed 2019·Granted Nov 15, 2022·0 cites·12 claims
- 2969US7209324B2Sliders bonded by a debondable encapsulant containing styrene and butadiene polymersHITACHI GLOBAL STORAGE NETHERL·Filed 2003·Granted Apr 24, 2007·7 cites·17 claims
- 3069US6660640B1Process for planarizing patterned metal structures for magnetic thin film headsIBM·Filed 2000·Granted Dec 9, 2003·6 cites·12 claims
- 3168US10370556B2Surface modification by polymer anchoring on porous substratesIBM·Filed 2016·Granted Aug 6, 2019·0 cites·22 claims
- 3267US11168234B2Enhanced adhesive materials and processes for 3D applicationsIBM·Filed 2020·Granted Nov 9, 2021·0 cites·8 claims
- 3367US7309754B2Stable encapsulant fluid capable of undergoing reversible Diels-Alder polymerizationHITACHI GLOBAL STORAGE TECH·Filed 2003·Granted Dec 18, 2007·6 cites·19 claims
- 3465US8623741B2Homogeneous porous low dielectric constant materialsPURUSHOTHAMAN SAMPATH·Filed 2012·Granted Jan 7, 2014·1 cites·18 claims
- 3565US4170685APolyvinyl pyridine microspheresCALIFORNIA INST OF TECHN·Filed 1977·Granted Oct 9, 1979·16 cites·4 claims
- 3664US5206117APhotosensitive polyamic alkyl ester composition and process for its useLABADIE JEFFREY W·Filed 1992·Granted Apr 27, 1993·27 cites·3 claims
- 3763US7820242B2Low-K interlevel dielectric materials and method of forming low-K interlevel dielectric layers and structuresIBM·Filed 2008·Granted Oct 26, 2010·0 cites·11 claims
- 3862US8927430B2Overburden removal for pore fill integration approachBRUCE ROBERT L·Filed 2011·Granted Jan 6, 2015·1 cites·16 claims
- 3961US7077970B2Sliders bonded by a debondable nonstoichiometric encapsulantHITACHI GLOBAL STORAGE NETHERL·Filed 2003·Granted Jul 18, 2006·4 cites·11 claims
- 4061US5446074APhotosensitive polyimide precursorsIBM·Filed 1993·Granted Aug 29, 1995·10 cites·2 claims
- 4160US4467000AProcess for coating a substrate with polyimideIBM·Filed 1983·Granted Aug 21, 1984·15 cites·8 claims
- 4259US10471418B2Selectively functionalized porous materialIBM·Filed 2015·Granted Nov 12, 2019·0 cites·13 claims
- 4359US7960442B2Nanoporous media templated from unsymmetrical amphiphilic porogensIBM·Filed 2005·Granted Jun 14, 2011·0 cites·21 claims
- 4459US7368483B2Porous composition of matter, and method of making sameIBM·Filed 2004·Granted May 6, 2008·5 cites·30 claims
- 4559US7064929B2Sliders bonded by a debondable encapsulant containing styrene and acrylate polymersHITACHI GLOBAL STORAGE NETHERL·Filed 2003·Granted Jun 20, 2006·3 cites·19 claims
- 4659US6812551B2Defect-free dielectric coatings and preparation thereof using polymeric nitrogenous porogensIBM·Filed 2003·Granted Nov 2, 2004·5 cites·11 claims
- 4758US10767084B2Enhanced adhesive materials and processes for 3D applicationsIBM·Filed 2018·Granted Sep 8, 2020·0 cites·20 claims
- 4858US8436062B2Nanoporous media templated from unsymmetrical amphiphilic porogensCHA JENNIFER NAM·Filed 2011·Granted May 7, 2013·0 cites·10 claims
- 4958US8268903B2Nanoporous media templated from unsymmetrical amphiphilic porogensDUBOIS GERAUD JEAN-MICHEL·Filed 2011·Granted Sep 18, 2012·0 cites·8 claims
- 5058US7931829B2Low-K interlevel dielectric materials and method of forming low-K interlevel dielectric layers and structuresIBM·Filed 2010·Granted Apr 26, 2011·0 cites·20 claims
Showing the top 50 of 84 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →