Inventor · disambiguated record
William E. Werther
Also filed as: WERTHER WILLIAM · WERTHER WILLIAM E
11 granted patents·567 citations·filing 1986–1995
93Inventor score
Top patents by PatentIndex Score
11 records- 0196US5479319AMulti-level assemblies for interconnecting integrated circuitsINTERCONNECT SYSTEMS INC·Filed 1992·Granted Dec 26, 1995·111 cites·20 claims
- 0295US5481436AMulti-level assemblies and methods for interconnecting integrated circuitsINTERCONNECT SYSTEMS INC·Filed 1994·Granted Jan 2, 1996·130 cites·29 claims
- 0390US4750092AInterconnection package suitable for electronic devices and methods for producing sameKOLLMORGEN TECH CORP·Filed 1986·Granted Jun 7, 1988·97 cites·42 claims
- 0489US5515241ASpace-saving assemblies for connecting integrated circuits to circuit boardsINTERCONNECT SYSTEMS INC·Filed 1995·Granted May 7, 1996·56 cites·20 claims
- 0588US5712768ASpace-saving assemblies for connecting integrated circuits to circuit boardsINTERCONNECT SYSTEMS INC·Filed 1995·Granted Jan 27, 1998·46 cites·18 claims
- 0683US5513076AMulti-level assemblies for interconnecting integrated circuitsINTERCONNECT SYSTEMS INC·Filed 1995·Granted Apr 30, 1996·40 cites·36 claims
- 0776US5481435AAdaptor assembly for adding functionality to a pin grid receptacle on a circuit boardINTERCONNECT SYSTEMS INC·Filed 1994·Granted Jan 2, 1996·28 cites·23 claims
- 0875US5625944AMethods for interconnecting integrated circuitsINTERCONNECT SYSTEMS INC·Filed 1995·Granted May 6, 1997·26 cites·18 claims
- 0950US5683256AIntegral thru-hole contactsMETHODE ELECTRONICS INC·Filed 1994·Granted Nov 4, 1997·14 cites·11 claims
- 1048US5791552AAssembly including fine-pitch solder bumping and method of formingMETHODE ELECTRONICS INC·Filed 1995·Granted Aug 11, 1998·16 cites·18 claims
- 1128USD305195SDrink coasterTOWERS LAWRENCE A·Filed 1987·Granted Dec 26, 1989·3 cites·1 claims
Join the waitlist — get patent alerts
Get an alert when William E. Werther files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →