Inventor · disambiguated record
William F. Wiedemann
Also filed as: WIEDEMANN III WILLIAM FRED · WIEDEMANN WILLIAM F
18 granted patents·5 pending applications·461 citations·filing 2003–2018
95Inventor score
Files withINTERCONNECT PORTFOLIO LLC10SILICON PIPE INC3FJELSTAD JOSEPH C2SAMSUNG ELECTRONICS CO LTD2WIEDEMANN III WILLIAM FRED2
Top patents by PatentIndex Score
23 records- 0197US8338713B2Cabled signaling system and components thereofFJELSTAD JOSEPH C·Filed 2007·Granted Dec 25, 2012·84 cites·18 claims
- 0296US7652381B2Interconnect system without through-holesINTERCONNECT PORTFOLIO LLC·Filed 2005·Granted Jan 26, 2010·52 cites·28 claims
- 0396US7651382B2Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrityINTERCONNECT PORTFOLIO LLC·Filed 2008·Granted Jan 26, 2010·60 cites·14 claims
- 0496US7613011B2Signal-segregating connector systemINTERCONNECT PORTFOLIO LLC·Filed 2007·Granted Nov 3, 2009·45 cites·15 claims
- 0595US7278855B2High speed, direct path, stair-step, electronic connectors with improved signal integrity characteristics and methods for their manufactureSILICON PIPE INC·Filed 2005·Granted Oct 9, 2007·31 cites·24 claims
- 0694US7227759B2Signal-segregating connector systemSILICON PIPE INC·Filed 2005·Granted Jun 5, 2007·46 cites·17 claims
- 0793US7280372B2Stair step printed circuit board structures for high speed signal transmissionsSILICON PIPE·Filed 2004·Granted Oct 9, 2007·78 cites·19 claims
- 0890US7192320B2Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integritySILICON PIPE INC·Filed 2005·Granted Mar 20, 2007·17 cites·3 claims
- 0987US7909615B1Torsionally-induced contact-force conductors for electrical connector systemsINTERCONNECT PORTFOLIO LLC·Filed 2010·Granted Mar 22, 2011·11 cites·2 claims
- 1084US7651336B2High speed, direct path, stair-step, electronic connectors with improved signal integrity characteristics and methods for their manufactureINTERCONNECT PORTFOLIO LLC·Filed 2007·Granted Jan 26, 2010·9 cites·26 claims
- 1182US8079848B2Electrical connector with conductors with a ramp to induce torsionYASUMURA GARY·Filed 2011·Granted Dec 20, 2011·9 cites·4 claims
- 1280US7845986B2Torsionally-induced contact-force conductors for electrical connector systemsINTERCONNECT PORTFOLIO LLC·Filed 2005·Granted Dec 7, 2010·13 cites·7 claims
- 1373US8047855B2High speed, direct path, stair-step, electronic connectors with improved signal integrity characteristics and methods for their manufactureSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted Nov 1, 2011·2 cites·18 claims
- 1465US8324727B2Low profile discrete electronic components and applications of sameFJELSTAD JOSEPH C·Filed 2010·Granted Dec 4, 2012·2 cites·16 claims
- 1561US7404746B2Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrityINTERCONNECT PORTFOLIO LLC·Filed 2006·Granted Jul 29, 2008·1 cites·20 claims
- 1645US2010127402A1Interconnect System without Through-HolesINTERCONNECT PORTFOLIO LLC·Filed 2010·Application pending·0 cites
- 1745US2019060661A1Method for irradiating skin and deeper tissues using unpackaged led lights to improve skin and tissue absorption of low level light energyWIEDEMANN III WILLIAM FRED·Filed 2018·Application pending·0 cites
- 1844US7732904B2Multi-surface contact IC packaging structures and assembliesINTERCONNECT PORTFOLIO LLC·Filed 2004·Granted Jun 8, 2010·1 cites·29 claims
- 1943US2013078826A1Torsionally-induced contact-force conductors for electrical connector systemsYASUMURA GARY·Filed 2012·Application pending·0 cites
- 2042US7701323B1Low profile discrete electronic components and applications of sameINTERCONNECT PORTFOLIO LLC·Filed 2004·Granted Apr 20, 2010·0 cites·17 claims
- 2140US2004094328A1Cabled signaling system and components thereofFiled 2003·Application pending·0 cites
- 2240US2018274534A1Pumping systemWIEDEMANN III WILLIAM FRED·Filed 2018·Application pending·0 cites
- 2339US7837477B2Electrical interconnection devices incorporating Fedundant contact points for reducing capacitive stubs and improved signal integritySAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted Nov 23, 2010·0 cites·24 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →