Inventor · disambiguated record
Wing Shenq Wong
Also filed as: WONG WING SHENQ
16 granted patents·1 pending application·42 citations·filing 2012–2021
90Inventor score
Technology areasH10W
Top patents by PatentIndex Score
17 records- 0195US11137517B2Molded range and proximity sensor with optical resin lensST MICROELECTRONICS RES & DEV LTD·Filed 2020·Granted Oct 5, 2021·4 cites·20 claims
- 0291US10061057B2Molded range and proximity sensor with optical resin lensST MICROELECTRONICS PTE LTD·Filed 2015·Granted Aug 28, 2018·8 cites·8 claims
- 0391US9525002B2Image sensor device with sensing surface cavity and related methodsST MICROELECTRONICS PTE LTD·Filed 2015·Granted Dec 20, 2016·11 cites·22 claims
- 0479US8779443B2Overmold with single attachment using optical filmST MICROELECTRONICS PTE LTD·Filed 2012·Granted Jul 15, 2014·6 cites·17 claims
- 0576US9608029B2Optical package with recess in transparent coverST MICROELECTRONICS PTE LTD·Filed 2013·Granted Mar 28, 2017·4 cites·25 claims
- 0673US9018753B2Electronic modulesST MICROELECTRONICS PTE LTD·Filed 2013·Granted Apr 28, 2015·3 cites·25 claims
- 0772US11693149B2Molded range and proximity sensor with optical resin lensST MICROELECTRONICS RES & DEV LTD·Filed 2021·Granted Jul 4, 2023·0 cites·20 claims
- 0872US9972557B2Integrated circuit (IC) package with a solder receiving area and associated methodsST MICROELECTRONICS PTE LTD·Filed 2014·Granted May 15, 2018·2 cites·30 claims
- 0967US9754861B2Patterned lead frameST MICROELECTRONICS PTE LTD·Filed 2014·Granted Sep 5, 2017·2 cites·16 claims
- 1067US9258467B2Camera moduleST MICROELECTRONICS PTE LTD·Filed 2013·Granted Feb 9, 2016·2 cites·22 claims
- 1159US10529652B2Integrated circuit (IC) package with a solder receiving area and associated methodsST MICROELECTRONICS PTE LTD·Filed 2019·Granted Jan 7, 2020·0 cites·20 claims
- 1258US10684389B2Molded range and proximity sensor with optical resin lensST MICROELECTRONICS PTE LTD·Filed 2018·Granted Jun 16, 2020·0 cites·20 claims
- 1357US10297534B2Integrated circuit (IC) package with a solder receiving area and associated methodsST MICROELECTRONICS PTE LTD·Filed 2018·Granted May 21, 2019·0 cites·26 claims
- 1444US9543282B2Optical sensor packageST MICROELECTRONICS PTE LTD·Filed 2013·Granted Jan 10, 2017·0 cites·22 claims
- 1544US2015332995A1Electronic device including components in component receiving cavity and related methodsST MICROELECTRONICS PTE LTD·Filed 2014·Application pending·0 cites
- 1640US9418920B2Integrated circuit (IC) package with thick die pad functioning as a heat sinkST MICROELECTRONICS PTE LTD·Filed 2015·Granted Aug 16, 2016·0 cites·24 claims
- 1739US9525094B2Proximity and ranging sensorST MICROELECTRONICS PTE LTD·Filed 2015·Granted Dec 20, 2016·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →