Inventor · disambiguated record
Won Kyoung Choi
Also filed as: CHOI WON K · CHOI WON-KYOUNG
63 granted patents·10 pending applications·355 citations·filing 2004–2022
98Inventor score
Files withHYUNDAI MOTOR CO LTD22SAMSUNG ELECTRONICS CO LTD15STATS CHIPPAC LTD12STATS CHIPPAC PTE LTD9CHOI WON KYOUNG8
Top patents by PatentIndex Score
73 records- 0197US9842798B2Semiconductor device and method of forming a PoP device with embedded vertical interconnect unitsSTATS CHIPPAC LTD·Filed 2013·Granted Dec 12, 2017·31 cites·6 claims
- 0296US9527723B2Semiconductor device and method of forming microelectromechanical systems (MEMS) packageSTATS CHIPPAC LTD·Filed 2015·Granted Dec 27, 2016·25 cites·12 claims
- 0396US8435881B2Semiconductor device and method of forming protective coating over interconnect structure to inhibit surface oxidationCHOI WON KYOUNG·Filed 2011·Granted May 7, 2013·33 cites·30 claims
- 0495US9738160B2Fail-safe method and apparatus for high voltage parts in a hybrid vehicleHYUNDAI MOTOR CO LTD·Filed 2013·Granted Aug 22, 2017·38 cites·13 claims
- 0594US10453785B2Semiconductor device and method of forming double-sided fan-out wafer level packageSTATS CHIPPAC LTD·Filed 2015·Granted Oct 22, 2019·14 cites·25 claims
- 0693US9704780B2Semiconductor device and method of forming low profile fan-out package with vertical interconnection unitsSTATS CHIPPAC LTD·Filed 2013·Granted Jul 11, 2017·14 cites·29 claims
- 0793US8890315B2Semiconductor device and method of forming interconnect structure over seed layer on contact pad of semiconductor die without undercutting seed layer beneath interconnect structureSTATS CHIPPAC LTD·Filed 2013·Granted Nov 18, 2014·10 cites·25 claims
- 0892US10189702B2Semiconductor device and method of forming microelectromechanical systems (MEMS) packageSTATS CHIPPAC PTE LTD·Filed 2016·Granted Jan 29, 2019·4 cites·23 claims
- 0992US9978665B2Semiconductor device and method of forming low profile fan-out package with vertical interconnection unitsSTATS CHIPPAC PTE LTD·Filed 2017·Granted May 22, 2018·7 cites·25 claims
- 1092US9754897B2Semiconductor device and method of forming electromagnetic (EM) shielding for LC circuitsSTATS CHIPPAC LTD·Filed 2015·Granted Sep 5, 2017·8 cites·20 claims
- 1192US8912650B2Semiconductor device and method of forming protective coating over interconnect structure to inhibit surface oxidationSTATS CHIPPAC LTD·Filed 2013·Granted Dec 16, 2014·11 cites·21 claims
- 1291US10388612B2Semiconductor device and method of forming electromagnetic (EM) shielding for LC circuitsSTATS CHIPPAC PTE LTD·Filed 2017·Granted Aug 20, 2019·6 cites·21 claims
- 1391US9721922B2Semiconductor device and method of forming fine pitch RDL over semiconductor die in fan-out packageSTATS CHIPPAC LTD·Filed 2013·Granted Aug 1, 2017·11 cites·23 claims
- 1490US10160325B2Vehicle power control method and system for jump-startHYUNDAI MOTOR CO LTD·Filed 2016·Granted Dec 25, 2018·9 cites·8 claims
- 1589US10046656B2Bidirectional powering on-board charger, vehicle power supply system including the same, and control method thereofHYUNDAI MOTOR CO LTD·Filed 2016·Granted Aug 14, 2018·8 cites·15 claims
- 1689US8742591B2Semiconductor device and method of forming insulating layer in notches around conductive TSV for stress reliefCHOI WON KYOUNG·Filed 2011·Granted Jun 3, 2014·10 cites·22 claims
- 1787US10446479B2Semiconductor device and method of forming a PoP device with embedded vertical interconnect unitsSTATS CHIPPAC PTE LTD·Filed 2017·Granted Oct 15, 2019·4 cites·6 claims
- 1886US9105532B2Semiconductor device and method of forming interconnect structure over seed layer on contact pad of semiconductor die without undercutting seed layer beneath interconnect structureSTATS CHIPPAC LTD·Filed 2014·Granted Aug 11, 2015·5 cites·25 claims
- 1984US9864018B2Method of diagnosing fault by using impedance of output terminal of power supply device for environmentally-friendly vehicleHYUNDAI MOTOR CO LTD·Filed 2014·Granted Jan 9, 2018·5 cites·6 claims
- 2084US9184139B2Semiconductor device and method of reducing warpage using a silicon to encapsulant ratioSTATS CHIPPAC LTD·Filed 2013·Granted Nov 10, 2015·6 cites·25 claims
- 2184US9007013B2Inverter control method and system for eco-friendly vehicleHYUNDAI MOTOR CO LTD·Filed 2012·Granted Apr 14, 2015·10 cites·12 claims
- 2284US8994304B2Method for controlling interior permanent magnet synchronous motorHYUNDAI MOTOR CO LTD·Filed 2012·Granted Mar 31, 2015·6 cites·8 claims
- 2383US8508067B2Motor drive system for hybrid vehicle and method for controlling the same in the event of failureSONG HONG SEOK·Filed 2010·Granted Aug 13, 2013·10 cites·2 claims
- 2482US10118501B2Control method and system for charging high voltage battery of vehicleHYUNDAI MOTOR CO LTD·Filed 2016·Granted Nov 6, 2018·4 cites·17 claims
- 2581US8587120B2Semiconductor device and method of forming interconnect structure over seed layer on contact pad of semiconductor die without undercutting seed layer beneath interconnect structureCHOI WON KYOUNG·Filed 2011·Granted Nov 19, 2013·4 cites·25 claims
- 2680US9172316B2Inverter control method and system for eco-friendly vehicleHYUNDAI MOTOR CO LTD·Filed 2013·Granted Oct 27, 2015·5 cites·25 claims
- 2780US7784177B2Method of manufacturing an image drumSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Aug 31, 2010·6 cites·14 claims
- 2877US12319564B2Semiconductor device and method of forming microelectromechanical systems (MEMS) packageSTATS CHIPPAC PTE LTD·Filed 2022·Granted Jun 3, 2025·0 cites·21 claims
- 2977US9934998B2Semiconductor device and method of singulating thin semiconductor wafer on carrier along modified region within non-active region formed by irradiating energySTATS CHIPPAC PTE LTD·Filed 2016·Granted Apr 3, 2018·2 cites·13 claims
- 3075US10090779B2Method and system for compensating for current sensor offset of inverterHYUNDAI MOTOR CO LTD·Filed 2016·Granted Oct 2, 2018·2 cites·15 claims
- 3175US7489327B2Toner adsorption image forming apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Feb 10, 2009·4 cites·15 claims
- 3273US7696104B2Mirror package and method of manufacturing the mirror packageSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Apr 13, 2010·6 cites·9 claims
- 3371US8686671B2Method for compensating nonlinearity of resolver for hybrid and fuel cell vehiclesJEON WOO YONG·Filed 2010·Granted Apr 1, 2014·6 cites·4 claims
- 3470US11370655B2Semiconductor device and method of forming microelectromechanical systems (MEMS) packageSTATS CHIPPAC PTE LTD·Filed 2020·Granted Jun 28, 2022·0 cites·22 claims
- 3569US9559004B2Semiconductor device and method of singulating thin semiconductor wafer on carrier along modified region within non-active region formed by irradiating energyHAN BYUNG JOON·Filed 2012·Granted Jan 31, 2017·2 cites·14 claims
- 3669US8380377B2Method for controlling cooling of power converter for hybrid electric vehicleHYUNDAI MOTOR CO LTD·Filed 2010·Granted Feb 19, 2013·5 cites·3 claims
- 3769US7828707B2Image drum for selectively absorbing toner thereonSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Nov 9, 2010·3 cites·5 claims
- 3868US10399453B2Method and system for controlling vehicular direct current converterHYUNDAI MOTOR CO LTD·Filed 2017·Granted Sep 3, 2019·1 cites·14 claims
- 3967US10662056B2Semiconductor device and method of forming microelectromechanical systems (MEMS) packageSTATS CHIPPAC PTE LTD·Filed 2018·Granted May 26, 2020·0 cites·23 claims
- 4067US8517249B2Soldering structure and method using ZnCHOI WON-KYOUNG·Filed 2007·Granted Aug 27, 2013·2 cites·7 claims
- 4165US10220721B2System and method for controlling a relay of an auxiliary batteryHYUNDAI MOTOR CO LTD·Filed 2016·Granted Mar 5, 2019·1 cites·8 claims
- 4264US10081247B2System, method and apparatus for protecting OBC output terminalHYUNDAI MOTOR CO LTD·Filed 2015·Granted Sep 25, 2018·1 cites·13 claims
- 4362US10160337B2Low voltage DC-DC converter of eco friendly vehicleHYUNDAI MOTOR CO LTD·Filed 2016·Granted Dec 25, 2018·1 cites·9 claims
- 4462US7294925B2Optical scanner package having heating damSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Nov 13, 2007·6 cites·11 claims
- 4560US9236805B2System and method for controlling DC-DC converterHYUNDAI MOTOR CO LTD·Filed 2013·Granted Jan 12, 2016·1 cites·6 claims
- 4660US7362484B2Optical scanner package with optical noise reductionSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Apr 22, 2008·2 cites·31 claims
- 4757US11127668B2Semiconductor device and method of forming double-sided fan-out wafer level packageJCET SEMICONDUCTOR SHAOXING CO LTD·Filed 2019·Granted Sep 21, 2021·0 cites·24 claims
- 4856US9076724B1Integrated circuit system with debonding adhesive and method of manufacture thereofCHOI WON KYOUNG·Filed 2013·Granted Jul 7, 2015·0 cites·18 claims
- 4955US7149023B2Optical scanner capable of flip-chip hermetic packagingSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Dec 12, 2006·1 cites·14 claims
- 5054US9601462B2Semiconductor device and method of forming UBM structure on back surface of TSV semiconductor waferSTATS CHIPPAC LTD·Filed 2014·Granted Mar 21, 2017·0 cites·22 claims
Showing the top 50 of 73 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →