Inventor · disambiguated record
Wonkeun Chung
Also filed as: CHUNG WONKEUN
14 granted patents·7 pending applications·45 citations·filing 2016–2024
89Inventor score
Files withSAMSUNG ELECTRONICS CO LTD21
Top patents by PatentIndex Score
21 records- 0194US10461167B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 29, 2019·18 cites·20 claims
- 0293US10475898B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 12, 2019·8 cites·20 claims
- 0390US10043803B2Semiconductor device having gate electrodes with stacked metal layersSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Aug 7, 2018·8 cites·16 claims
- 0488US10892342B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 12, 2021·2 cites·20 claims
- 0587US10468411B2Semiconductor device having a multi-portion gate electrodeSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 5, 2019·5 cites·18 claims
- 0682US10615264B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Apr 7, 2020·2 cites·20 claims
- 0776US12021080B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jun 25, 2024·0 cites·20 claims
- 0873US11121131B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 14, 2021·1 cites·20 claims
- 0971US12389660B1Semiconductor device including backside contact structure with silicide layer formed in FEOL processSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Aug 12, 2025·0 cites·14 claims
- 1069US11742351B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 29, 2023·0 cites·20 claims
- 1169US10763335B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 1, 2020·1 cites·17 claims
- 1268US11626499B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 11, 2023·0 cites·20 claims
- 1363US11195927B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 7, 2021·0 cites·20 claims
- 1463US2025323160A1Semiconductor device including backside contact having wide lower portionSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1563US2025316594A1Semiconductor device including backside contact structure formed based on wide placeholder structureSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1662US2025324693A1Method of forming backside contact of semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1761US2025324731A1Integrated circuit devices including a backside power distribution network structure and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1859US2025192029A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1958US2025107179A1Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2058US2025096134A1Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2152US12317572B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 27, 2025·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →