Inventor · disambiguated record
Wolfgang Dietze
Also filed as: BACHMANN GERHARD · DIETZE WOLFGANG · REUTTER JORG
21 granted patents·273 citations·filing 1973–2012
95Inventor score
Top patents by PatentIndex Score
21 records- 0190US4125643AProcess for depositing elemental silicon semiconductor material from a gas phaseSIEMENS AG·Filed 1977·Granted Nov 14, 1978·41 cites·3 claims
- 0286US4148931AProcess for depositing elemental silicon semiconductor material from a gas phaseSIEMENS AG·Filed 1978·Granted Apr 10, 1979·32 cites·4 claims
- 0380US3943218AMethod of manufacturing shaped hollow bodiesSIEMENS AG·Filed 1973·Granted Mar 9, 1976·21 cites·2 claims
- 0473US4203940ACrystal wafer rack structures and the method of producing the sameSIEMENS AG·Filed 1974·Granted May 20, 1980·20 cites·3 claims
- 0570US4255463AMethod of deposition of silicon in fine crystalline formSIEMENS AG·Filed 1979·Granted Mar 10, 1981·16 cites·4 claims
- 0670US3962391ADisc support structure and method of producing the sameSIEMENS AG·Filed 1974·Granted Jun 8, 1976·16 cites·5 claims
- 0768US8984966B2Sub-millinewton capacitive MEMS force sensor for mechanical testing on a microscopeFEMTOTOOLS AG·Filed 2012·Granted Mar 24, 2015·4 cites·6 claims
- 0868US4093201ADisc support structureSIEMENS AG·Filed 1975·Granted Jun 6, 1978·20 cites·1 claims
- 0967US4178569AHybrid for two-wire full-duplex transmission of digital signalsINT STANDARD ELECTRIC CORP·Filed 1978·Granted Dec 11, 1979·18 cites·11 claims
- 1061US3979490AMethod for the manufacture of tubular bodies of semiconductor materialSIEMENS AG·Filed 1973·Granted Sep 7, 1976·9 cites·9 claims
- 1161US3962670AHeatable hollow semiconductorSIEMENS AG·Filed 1974·Granted Jun 8, 1976·8 cites·1 claims
- 1259US4102298ADevice for deposition of semi-conductor materialSIEMENS AG·Filed 1976·Granted Jul 25, 1978·15 cites·18 claims
- 1357US4426408AMethod of deposition of silicon in fine crystalline formSIEMENS AG·Filed 1979·Granted Jan 17, 1984·9 cites·9 claims
- 1447US4345142ADirectly heatable semiconductor tubular bodiesSIEMENS AG·Filed 1978·Granted Aug 17, 1982·9 cites·2 claims
- 1543US4532090AMethod and apparatus for the manufacture of high purity silicon granulateSIEMENS AG·Filed 1983·Granted Jul 30, 1985·8 cites·5 claims
- 1643US4035460AShaped bodies and production of semiconductor materialSIEMENS AG·Filed 1975·Granted Jul 12, 1977·8 cites·3 claims
- 1742US4007369ATubular ovenSIEMENS AG·Filed 1976·Granted Feb 8, 1977·7 cites·5 claims
- 1841US5058156ANetwork interface and communication terminalSTANDARD ELEKTRIK LORENZ AG·Filed 1989·Granted Oct 15, 1991·9 cites·3 claims
- 1931US4475206AMethod and device for tapping a furnace containing a tappable meltSIEMENS AG·Filed 1983·Granted Oct 2, 1984·1 cites·4 claims
- 2031US4034705AShaped bodies and production of semiconductor materialSIEMENS AG·Filed 1975·Granted Jul 12, 1977·2 cites·3 claims
- 2122US4015922AApparatus for the manufacture of tubular bodies of semiconductor materialSIEMENS AG·Filed 1976·Granted Apr 5, 1977·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →