Inventor · disambiguated record
Wolfgang Gmach
Also filed as: GMACH WOLFGANG
4 granted patents·1 pending application·2 citations·filing 2012–2021
56Inventor score
Top patents by PatentIndex Score
5 records- 0164US9073135B2Method for slicing wafers from a workpieceHUBER ANTON·Filed 2012·Granted Jul 7, 2015·2 cites·8 claims
- 0248US12251767B2Method for separating a plurality of slices from workpieces by means of a wire saw during a sequence of separation processesSILTRONIC AG·Filed 2021·Granted Mar 18, 2025·0 cites·7 claims
- 0347US12275079B2Method for separating a plurality of slices from workpieces by means of a wire saw during a sequence of separation processesSILTRONIC AG·Filed 2021·Granted Apr 15, 2025·0 cites·7 claims
- 0439US2022040883A1Method for producing semiconductor wafers by means of a wire sawSILTRONIC AG·Filed 2019·Application pending·0 cites
- 0537US8746227B2Method for slicing wafers from a workpieceHUBER ANTON·Filed 2012·Granted Jun 10, 2014·0 cites·4 claims
Join the waitlist — get patent alerts
Get an alert when Wolfgang Gmach files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →