Inventor · disambiguated record
Wong Hua
Also filed as: HUA WONG E · WONG EE HUA
1 granted patent·1 pending application·23 citations·filing 1999–2005
41Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0147US6424047B1Plastic ball grid array package for passing JEDEC Level 1 Moisture Sensitivity TestINST OF MICROELECTRONICS·Filed 1999·Granted Jul 23, 2002·23 cites·27 claims
- 0232US2006009029A1Wafer level through-hole plugging using mechanical forming techniqueAGENCY SCIENCE TECH & RES·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →