Inventor · disambiguated record
Wooseup Hwang
Also filed as: HWANG WOOSEUP
1 granted patent·4 pending applications·0 citations·filing 2022–2025
13Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD5
Top patents by PatentIndex Score
5 records- 0153US2025253160A1Method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0251US2025226283A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0348US12300509B2Method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 13, 2025·0 cites·20 claims
- 0445US2024203813A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0537US2023019350A1Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →