Inventor · disambiguated record
Wonkeun Kim
Also filed as: KIM WONKEUN
9 granted patents·8 pending applications·10 citations·filing 2011–2025
78Inventor score
Top patents by PatentIndex Score
17 records- 0186US9177942B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Nov 3, 2015·9 cites·13 claims
- 0282US11342310B2Semiconductor chip, semiconductor device, and semiconductor package including the semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 24, 2022·1 cites·20 claims
- 0366US11784168B2Semiconductor chip, semiconductor device, and semiconductor package including the semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 10, 2023·0 cites·20 claims
- 0465US2025279419A1Lithium metal negative electrode, electrolyte additive for lithium secondary battery and electrolyte including the sameHYUNDAI MOTOR CO LTD·Filed 2025·Application pending·0 cites
- 0564US2025329783A1Electrolyte solution for lithium secondary battery and lithium secondary battery including the sameHYUNDAI MOTOR CO LTD·Filed 2024·Application pending·0 cites
- 0662US11870073B2Cathode materials for lithium oxygen batteriesUNIV WASHINGTON STATE·Filed 2019·Granted Jan 9, 2024·0 cites·10 claims
- 0762US2025210717A1Electrolyte for lithium metal battery, and lithium metal battery including the sameHYUNDAI MOTOR CO LTD·Filed 2024·Application pending·0 cites
- 0861US2025336875A1Underfill film, semiconductor package including underfill film, and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0961US2025357459A1Evaluation apparatus and evaluation method for lithium metal batteryHYUNDAI MOTOR CO LTD·Filed 2024·Application pending·0 cites
- 1055US2024297150A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1154US2024079260A1Adhesive tape sheet, method of manufacturing the same and method of manufacturing semiconductor devices using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1250US11876031B2Thermal interface material paste and semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 16, 2024·0 cites·18 claims
- 1349US11211273B2Carrier substrate and packaging method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Dec 28, 2021·0 cites·11 claims
- 1449US2023135089A1Release film and method of manufacturing semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1548US10910339B2Flip chip bonding methodSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 2, 2021·0 cites·19 claims
- 1647US12354879B2Method of fabricating semiconductor device and method of separating substrateSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 8, 2025·0 cites·20 claims
- 1731US8673688B2Semiconductor package and method of manufacturing the sameKIM WONKEUN·Filed 2011·Granted Mar 18, 2014·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →