Inventor · disambiguated record
Woonbae Kim
Also filed as: KIM WOONBAE
12 granted patents·6 pending applications·17 citations·filing 2015–2024
85Inventor score
Files withSAMSUNG ELECTRONICS CO LTD18
Top patents by PatentIndex Score
18 records- 0190US10944853B2Electronic device including slidable bodySAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Mar 9, 2021·7 cites·20 claims
- 0283US10304764B2Film product, film packages and package modules using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 28, 2019·5 cites·19 claims
- 0378US11581348B2Semiconductor package including image sensor chip, transparent substrate, and joining structureSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 14, 2023·1 cites·20 claims
- 0475US10760930B2Sensor package, method of manufacturing the same, and method of manufacturing lid structureSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 1, 2020·2 cites·11 claims
- 0567US12261181B2Semiconductor package including image sensor chip, transparent substrate, and joining structureSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Mar 25, 2025·0 cites·20 claims
- 0664US9601445B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Mar 21, 2017·1 cites·19 claims
- 0762US10282587B2Sensing module substrate and sensing module including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted May 7, 2019·1 cites·20 claims
- 0861US11131568B2Sensor package, method of manufacturing the same, and method of manufacturing lid structureSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 28, 2021·0 cites·20 claims
- 0957US12418606B2Electronic device comprising display moduleSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Sep 16, 2025·0 cites·14 claims
- 1056US12495633B2Semiconductor package including stack structure of logic chip and sensing chipsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 9, 2025·0 cites·15 claims
- 1156US2020372232A1Fingerprint sensor package and display apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Application pending·0 cites
- 1254US2024162213A1Chip on film package and display apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1354US2025087562A1Chip on film package and display device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1453US12262496B2Tray support structure and electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Mar 25, 2025·0 cites·20 claims
- 1553US10776601B2Fingerprint sensor package and display apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 15, 2020·0 cites·20 claims
- 1653US2024014092A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1752US2024321902A1Chip-on-film package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1850US2025131230A1Fingerprint sensor package carrier and fingerprint sensor package assembly methodSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →