Inventor · disambiguated record
Won Young Kim
Also filed as: KIM WON Y · KIM WON-YOUNG
45 granted patents·35 pending applications·52 citations·filing 1995–2025
96Inventor score
Files withSAMSUNG ELECTRONICS CO LTD26KOREA ELECTRONICS TELECOMM14LOTTE CHEMICAL CORP5CUCKOO ELECTRONICS CO LTD4ELECTRONICS & TELECOMMUNICATIONS RES INST4
Top patents by PatentIndex Score
80 records- 0186US9070824B2Heterogeneous laminate including graphene, and thermoelectric material, thermoelectric module, and thermoelectric apparatus including the heterogeneous laminateSAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted Jun 30, 2015·5 cites·28 claims
- 0285US2025300136A1Semiconductor package having chip stackSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0384US12327821B2Semiconductor package having chip stackSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Jun 10, 2025·0 cites·11 claims
- 0481US10679956B2Semiconductor memory chip, semiconductor memory package, and electronic system using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 9, 2020·4 cites·20 claims
- 0579US12123550B2High pressure tank having hoop layer and helical layer wound thereon and method of manufacturing sameLOTTE CHEMICAL CORP·Filed 2020·Granted Oct 22, 2024·1 cites·5 claims
- 0677US10985138B2Semiconductor package having a plurality of chips and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 20, 2021·2 cites·16 claims
- 0773US9859204B2Semiconductor devices with redistribution padsSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jan 2, 2018·2 cites·18 claims
- 0872US11916042B2Semiconductor package having chip stackSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 27, 2024·0 cites·20 claims
- 0970US10714438B2Semiconductor device having metal bump and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jul 14, 2020·1 cites·25 claims
- 1069US10722064B2Electric cookerCUCKOO ELECTRONICS CO LTD·Filed 2018·Granted Jul 28, 2020·1 cites·19 claims
- 1168US10736457B2Electric cookerCUCKOO ELECTRONICS CO LTD·Filed 2018·Granted Aug 11, 2020·1 cites·16 claims
- 1268US6916759B2Method for producing a catalyst for homo-or co-polymerization of ethyleneSAMSUNG ATOFINA CO LTD·Filed 2001·Granted Jul 12, 2005·7 cites·12 claims
- 1367US10622231B2Method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Apr 14, 2020·1 cites·20 claims
- 1464US11037894B2Semiconductor device having metal bump and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 15, 2021·0 cites·20 claims
- 1563US6989342B2Catalyst for polymerization and copolymerization of ethyleneSAMSUNG GENERAL CHEMICALS CO·Filed 2002·Granted Jan 24, 2006·7 cites·14 claims
- 1662US12493946B2Apparatus and method for verifying optical fiber work using artificial intelligenceFIBERFOX INC·Filed 2022·Granted Dec 9, 2025·0 cites·13 claims
- 1761US10930618B2Semiconductor package having chip stackSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Feb 23, 2021·0 cites·14 claims
- 1861US2025054913A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1960US12031681B2Knob cap for high-pressure tankLOTTE CHEMICAL CORP·Filed 2020·Granted Jul 9, 2024·0 cites·9 claims
- 2059US9015845B2Transit control for dataSAMSUNG SDS CO LTD·Filed 2012·Granted Apr 21, 2015·1 cites·17 claims
- 2159US2024371808A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2259US2024222273A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2358US12038134B2Knob cap for high-pressure tankLOTTE CHEMICAL CORP·Filed 2020·Granted Jul 16, 2024·0 cites·10 claims
- 2458US10827870B2Electric cookerCUCKOO ELECTRONICS CO LTD·Filed 2018·Granted Nov 10, 2020·1 cites·12 claims
- 2558US10024585B2Heat radiation-thermoelectric fin, and thermoelectric module and thermoelectric apparatus including the heat radiation-thermoelectric finSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jul 17, 2018·0 cites·14 claims
- 2658US2024021575A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2758US2024203939A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2855US2025347627A1Apparatus for detecting respiratory viruses in real timeFIBERFOX INC·Filed 2025·Application pending·0 cites
- 2954US11598487B2Sealing apparatus for high-pressure tank and high-pressure tank comprising sameLOTTE CHEMICAL CORP·Filed 2019·Granted Mar 7, 2023·0 cites·6 claims
- 3054US2025012402A1High-Pressure Vessel Having Impact-Resistant Stiffener MemberLOTTE CHEMICAL CORP·Filed 2022·Application pending·0 cites
- 3153US10784216B2Semiconductor device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 22, 2020·0 cites·20 claims
- 3253US5666427AMethod of and apparatus for controlling noise generated in confined spacesSAMSUNG HEAVY IND·Filed 1995·Granted Sep 9, 1997·18 cites·5 claims
- 3352US12424474B2Article transfer apparatus and method for transferring articleSEMES CO LTD·Filed 2022·Granted Sep 23, 2025·0 cites·9 claims
- 3452US12165974B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 10, 2024·0 cites·17 claims
- 3550US11816520B2IoT-based cable used in cable management systemLS CABLE & SYSTEM LTD·Filed 2020·Granted Nov 14, 2023·0 cites·10 claims
- 3650US10141255B2Circuit boards and semiconductor packages including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 27, 2018·0 cites·20 claims
- 3750US2008288380A1Method and System for Providing Streamed Game Software on Portable TerminalKOREA ELECTRONICS TELECOMM·Filed 2006·Application pending·0 cites
- 3850US2024177944A1Composite material for electrical contacts and method of producing sameLS ELECTRIC CO LTD·Filed 2021·Application pending·0 cites
- 3950US2023134506A1System and method for managing vm images for high-performance virtual desktop servicesELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2022·Application pending·0 cites
- 4048US10297559B2Semiconductor device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted May 21, 2019·0 cites·20 claims
- 4147US10002822B2Circuit boards and semiconductor packages including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jun 19, 2018·0 cites·20 claims
- 4246US2016364792A1Cloud service brokerage method and apparatus using service image storeELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2016·Application pending·0 cites
- 4346US2023339523A1Rail inspection deviceSEMES CO LTD·Filed 2023·Application pending·0 cites
- 4445US10269740B2Semiconductor memory chip, semiconductor memory package, and electronic system using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 23, 2019·0 cites·30 claims
- 4545US2009254890A1Apparatus and method for generating install-less software from installation package of softwareKOREA ELECTRONICS TELECOMM·Filed 2009·Application pending·0 cites
- 4643US9554467B2Printed circuit board and semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jan 24, 2017·0 cites·14 claims
- 4743US8994158B2Semiconductor packages having lead framesKIM DO-HYUN·Filed 2011·Granted Mar 31, 2015·0 cites·20 claims
- 4843US2010077396A1Portable storage device for supporting portable computing system and portable computing based system using the sameCHOI JI HOON·Filed 2007·Application pending·0 cites
- 4943US2008256178A1Method and Apparatus for Providing Software by Functional Units in a Software Streaming SystemKOREA ELECTRONICS TELECOMM·Filed 2006·Application pending·0 cites
- 5042US11402559B2Optical filter with layers having refractive index greater than 3OPTRONTEC CO LTD·Filed 2020·Granted Aug 2, 2022·0 cites·17 claims
Showing the top 50 of 80 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →