Inventor · disambiguated record
Woopoung Kim
Also filed as: KIM WOOPOUNG
4 granted patents·23 pending applications·152 citations·filing 2001–2025
76Inventor score
Top patents by PatentIndex Score
27 records- 0197US8588280B2Asymmetric communication on shared linksOH KYUNG SUK·Filed 2008·Granted Nov 19, 2013·140 cites·22 claims
- 0276US7915912B2Signal lines with internal and external terminationRAMBUS INC·Filed 2009·Granted Mar 29, 2011·8 cites·23 claims
- 0373US8130010B2Signal lines with internal and external terminationOH KYUNG SUK·Filed 2011·Granted Mar 6, 2012·4 cites·24 claims
- 0462US2025118720A1System and methods for an embedded bridge architectureSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0562US2025174567A1Glass interposer semiconductor package with integrated stack capacitor and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0662US2025379198A1System and methods for co-package optics architectureSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0762US2025118677A1System and methods for a multi-stack architectureSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0862US2025203889A1Silicon substrate semiconductor package with integrated stack capacitor and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0961US2025201669A1System and methods for a liquid cooling package architectureSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1061US2025167193A1System and methods for a backside package architectureSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1161US2025014986A1Embedded integrated stack capacitor (isc) in substrate build-up layerSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1261US2025201795A1System and methods for a modular hybrid bonding package architectureSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1360US2025323134A1Panel-level glass based embedded silicon bridge package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1460US2025293227A1Hybrid reconstituted panel level packagingSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1559US2025125311A1Semiconductor packages with stacked memory and logicSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1659US2025192121A1Semiconductor device with integrated stack capacitor and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1759US2025112157A1System and methods for a metal interface architectureSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1857US2025284074A1System and methods for co-package optics package architectureSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1954US2025385234A1Semiconductor package and system including semiconductor chip and voltage regulator, and method of manufacturing thereofSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 2050US2025300148A1System and methods for backside power delivery for packagesSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 2150US2025300144A1System and methods for embedded multi-stack packagesSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 2250US2025300087A1Systems, methods, and devices for semiconductor packaging with stacked devices having power delivery networkSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 2350US2025300150A1Systems, methods, and devices for semiconductor packaging with wafer on wafer operationsSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 2448US2025293208A1System and methods for backside power delivery for semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 2548US2025385147A1Semiconductor device including hybrid diamond thermal interposerSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 2643US8692573B2Signal lines with internal and external terminationOH KYUNG SUK·Filed 2011·Granted Apr 8, 2014·0 cites·25 claims
- 2734US2002158305A1Organic substrate having integrated passive componentsFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →