Inventor · disambiguated record
Wongyou Kim
Also filed as: KIM WONGYOU
2 granted patents·0 citations·filing 2020–2022
28Inventor score
Technology areasH10W
Files withSTATS CHIPPAC PTE LTD2
Top patents by PatentIndex Score
2 records- 0163US12009314B2Semiconductor device and method of compartment shielding using bond wiresSTATS CHIPPAC PTE LTD·Filed 2022·Granted Jun 11, 2024·0 cites·28 claims
- 0256US11450618B2Semiconductor device and method of compartment shielding using bond wiresSTATS CHIPPAC PTE LTD·Filed 2020·Granted Sep 20, 2022·0 cites·23 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →