Inventor · disambiguated record
Won Sang Lee
Also filed as: LEE WON SANG
23 granted patents·2 pending applications·99 citations·filing 1996–2023
93Inventor score
Top patents by PatentIndex Score
25 records- 0197US11521957B1Semiconductor device and method of manufactureRFHIC CORP·Filed 2021·Granted Dec 6, 2022·8 cites·20 claims
- 0289US10128107B1Wafers having III-Nitride and diamond layersRFHIC CORP·Filed 2017·Granted Nov 13, 2018·15 cites·20 claims
- 0382US12261206B2Method of forming vias in a GaN/diamond waferRFHIC CORP·Filed 2023·Granted Mar 25, 2025·0 cites·14 claims
- 0481US10861947B2Methods for processing high electron mobility transistor (HEMT)RFHIC CORP·Filed 2020·Granted Dec 8, 2020·1 cites·12 claims
- 0580US10604597B2PolypropyleneLG CHEMICAL LTD·Filed 2017·Granted Mar 31, 2020·1 cites·9 claims
- 0679US5930610AMethod for manufacturing T-gateLG SEMICON CO LTD·Filed 1996·Granted Jul 27, 1999·45 cites·16 claims
- 0778US11901417B2GaN/diamond wafersRFHIC CORP·Filed 2022·Granted Feb 13, 2024·0 cites·11 claims
- 0878US11901418B2GaN/diamond wafersRFHIC CORP·Filed 2022·Granted Feb 13, 2024·0 cites·10 claims
- 0978US10217827B2High electron mobility transistor (HEMT)RFHIC CORP·Filed 2017·Granted Feb 26, 2019·2 cites·11 claims
- 1074US10906998B2Non-stretched polypropylene-based filmLG CHEMICAL LTD·Filed 2019·Granted Feb 2, 2021·0 cites·11 claims
- 1173US11502175B2GaN/diamond wafersRFHIC CORP·Filed 2020·Granted Nov 15, 2022·0 cites·13 claims
- 1273US11476335B2GaN/diamond wafersRFHIC CORP·Filed 2020·Granted Oct 18, 2022·0 cites·12 claims
- 1373US11424328B2GaN/diamond wafersRFHIC CORP·Filed 2020·Granted Aug 23, 2022·0 cites·15 claims
- 1472US11652146B2Method of forming a semiconductor wafer containing a gallium-nitride layer and two diamond layersRFHIC CORP·Filed 2020·Granted May 16, 2023·0 cites·12 claims
- 1572US10707311B2High electron mobility transistor (HEMT)RFHIC CORP·Filed 2018·Granted Jul 7, 2020·1 cites·9 claims
- 1665US11146243B2Bulk acoustic wave filterRFHIC CORP·Filed 2020·Granted Oct 12, 2021·0 cites·20 claims
- 1760US10214601B2Non-stretched polypropylene-based filmLG CHEMICAL LTD·Filed 2015·Granted Feb 26, 2019·0 cites·11 claims
- 1859USD639879SGolf putter headLEE WON-SANG·Filed 2010·Granted Jun 14, 2011·12 cites·1 claims
- 1956US2024003638A1Heat exchangerHYUNDAI WIA CORP·Filed 2023·Application pending·0 cites
- 2055US10594298B2Bulk acoustic wave filterRFHIC CORP·Filed 2017·Granted Mar 17, 2020·0 cites·12 claims
- 2147US9000471B2LED moduleDAEWON INNOST CO LTD·Filed 2014·Granted Apr 7, 2015·0 cites·7 claims
- 2246US6091142AAssembly for dissipating heat from a stacked semiconductor packageLG ELECTRONICS INC·Filed 1997·Granted Jul 18, 2000·13 cites·10 claims
- 2345US8697461B2LED module and manufacturing method thereofLEE WON SANG·Filed 2011·Granted Apr 15, 2014·0 cites·20 claims
- 2436US2009135928A1Device, apparatus, and method for low-power fast fourier transformJANG YOUNG-BEOM·Filed 2007·Application pending·0 cites
- 2530US5960261AMethod for manufacturing semiconductor packageLG ELECTRONICS INC·Filed 1997·Granted Sep 28, 1999·1 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →