Inventor · disambiguated record
Wonil Lee
Also filed as: LEE WONIL
28 granted patents·7 pending applications·33 citations·filing 2011–2025
94Inventor score
Files withSAMSUNG ELECTRONICS CO LTD25LEE WONIL3SAMSUNG SDI CO LTD3JETEMA CO LTD2KOREA ADVANCED INST SCI & TECH1
Top patents by PatentIndex Score
35 records- 0195US11653396B2Method and device for communication between network entities in cloud LAN environmentSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 16, 2023·5 cites·20 claims
- 0292US11147107B2Method and device for communication between network entities in cloud LAN environmentSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Oct 12, 2021·9 cites·16 claims
- 0389US11574873B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 7, 2023·2 cites·17 claims
- 0489US2025393083A1Method and device for communication between network entities in cloud lan environmentSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0585US12489071B2Semiconductor chip and semiconductor package including bonding layers having alignment marksSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 2, 2025·1 cites·20 claims
- 0685US12414167B2Method and device for communication between network entities in cloud LAN environmentSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Sep 9, 2025·0 cites·20 claims
- 0785US12310713B2Method of quantifying magnetic resonance diffusion parameters by using diffusion weighted magnetic resonance imagesKOREA ADVANCED INST SCI & TECH·Filed 2023·Granted May 27, 2025·2 cites·10 claims
- 0884US10306526B2Method and apparatus for controlling handover in a wireless communication systemSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 28, 2019·3 cites·20 claims
- 0983US11984415B2Interposer, method for fabricating the same, and semiconductor package having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 14, 2024·1 cites·20 claims
- 1082US11133553B2Battery packSAMSUNG SDI CO LTD·Filed 2017·Granted Sep 28, 2021·3 cites·16 claims
- 1182US10736008B2Method and apparatus for controlling handover in a wireless communication systemSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 4, 2020·2 cites·24 claims
- 1278US2024404955A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1377US12058744B2Method and device for communication between network entities in cloud LAN environmentSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Aug 6, 2024·0 cites·20 claims
- 1477US8916280B2Battery packLEE WONIL·Filed 2011·Granted Dec 23, 2014·3 cites·19 claims
- 1576US12087696B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Sep 10, 2024·0 cites·19 claims
- 1675US11758454B2Method and apparatus for controlling handover in wireless communication systemSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 12, 2023·0 cites·14 claims
- 1774US12417988B2Interposer, method for fabricating the same, and semiconductor package having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Sep 16, 2025·0 cites·13 claims
- 1873US9269942B2Secondary batterySAMSUNG SDI CO LTD·Filed 2013·Granted Feb 23, 2016·1 cites·13 claims
- 1969US11343739B2Method and apparatus for controlling handover in wireless communication systemSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 24, 2022·0 cites·24 claims
- 2068US8691428B2Battery pack comprising three case coveringsLEE WONIL·Filed 2011·Granted Apr 8, 2014·1 cites·19 claims
- 2167US12451449B2Semiconductor package, and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 21, 2025·0 cites·20 claims
- 2263US2025183206A1Semiconductor chip and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2360US2025201745A1Semiconductor chip and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2458US12512428B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 30, 2025·0 cites·20 claims
- 2557US2025258571A1Touch sensing unit and display apparatus including the sameSAMSUNG DISPLAY CO LTD·Filed 2024·Application pending·0 cites
- 2657US2024096831A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2755US12080691B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 3, 2024·0 cites·20 claims
- 2854US12398363B2Medium composition for botulinum toxin production by culturing of Clostridium botulinumJETEMA CO LTD·Filed 2020·Granted Aug 26, 2025·0 cites·1 claims
- 2952US12168790B2Method of preparing toxinJETEMA CO LTD·Filed 2020·Granted Dec 17, 2024·0 cites·2 claims
- 3049US11297528B2Apparatus and method for controlling congestion in wireless communication systemSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Apr 5, 2022·0 cites·20 claims
- 3147US11317278B2Device and method for detecting mismatch of encryption parameter in wireless communication systemSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Apr 26, 2022·0 cites·12 claims
- 3246US8691410B2Battery packLEE WONIL·Filed 2012·Granted Apr 8, 2014·0 cites·18 claims
- 3345US11244894B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 8, 2022·0 cites·20 claims
- 3445US11166193B2Terminal and base station in wireless communication system, and communication method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 2, 2021·0 cites·15 claims
- 3541US2019267580A1Battery packSAMSUNG SDI CO LTD·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →