Inventor · disambiguated record
Won-Chul Lim
Also filed as: LIM WON-CHUL
6 granted patents·2 pending applications·10 citations·filing 2005–2014
74Inventor score
Top patents by PatentIndex Score
8 records- 0172US7425466B2Wire bonding system and method of useSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Sep 16, 2008·6 cites·5 claims
- 0261US8431442B2Methods of manufacturing semiconductor chipsPARK SANG WOOK·Filed 2011·Granted Apr 30, 2013·1 cites·20 claims
- 0359US8870047B2Wafer dicing press and method and semiconductor wafer dicing system including the sameLIM WON-CHUL·Filed 2011·Granted Oct 28, 2014·1 cites·15 claims
- 0458US7199465B2Wire bonding system and method of useSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Apr 3, 2007·2 cites·17 claims
- 0551US9252055B2Wafer dicing press and method and semiconductor wafer dicing system including the sameLIM WON-CHUL·Filed 2014·Granted Feb 2, 2016·0 cites·5 claims
- 0644US8159831B2Printed circuit board for accomplishing narrow scribe lane and semiconductor package including the printed circuit boardLIM WON-CHUL·Filed 2009·Granted Apr 17, 2012·0 cites·20 claims
- 0739US2007290372A1Semiconductor device having wire loop and method and apparatus for manufacturing the semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 0835US2007029650A1Semiconductor package and package stacking structure and method using the sameLIM WON-CHUL·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →